Presentation
9 March 2024 Revolutionizing technology with the GaAs platform: leading the way in integrated photonics for next-generation computing and sensing solutions
Hamed Dalir, Belal Jahannia, Salem Altaleb, Jiachi Ye, Hao Wang, Chandraman Patil, Navid Asadizanjani, Elham Heidari, Babak Nikoobakht
Author Affiliations +
Abstract
Here, we're pioneering a novel approach in photonics, targeting the development of ultra-low power communication systems and advanced sensing technologies. Central to our strategy is the implementation of a unique zig-zag structure, designed to achieve femtojoule (fJ) per bit communication efficiency. A key innovation in our approach is the integration of unidirectional coupling through on-chip isolation, seamlessly connecting a Transverse Coupled Cavity VCSEL (TCCVCSEL) to the modulator and then to a waveguide. This project has wide-ranging implications, extending beyond just creating new devices. It's geared towards establishing a robust III/V platform, serving as a cornerstone in the field of photonics and integrated circuit technology. Our work is poised to catalyze advancements in high-speed, low-power photonic systems, potentially setting new benchmarks in the industry.
Conference Presentation
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Hamed Dalir, Belal Jahannia, Salem Altaleb, Jiachi Ye, Hao Wang, Chandraman Patil, Navid Asadizanjani, Elham Heidari, and Babak Nikoobakht "Revolutionizing technology with the GaAs platform: leading the way in integrated photonics for next-generation computing and sensing solutions", Proc. SPIE PC12894, Next-Generation Optical Communication: Components, Sub-Systems, and Systems XIII, PC1289404 (9 March 2024); https://doi.org/10.1117/12.3002994
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KEYWORDS
Laser bonding

Silicon photonics

Laser sources

Photorefractive polymers

Polymers

Connectors

Photodetectors

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