Paul Pigram, Peter Timbrell, Robert Lamb, Mark Sceats, Andrea Cox
Optical Engineering, Vol. 33, Issue 08, (August 1994) https://doi.org/10.1117/12.177113
TOPICS: Optical fibers, Silicon, Optical alignment, Coating, Semiconducting wafers, Microscopes, Fusion splicing, Fiber coatings, Optoelectronic devices, Telecommunications
The optical and physical interconnection of optical fibers with optoelectronic devices is a critical technology in a wide range of telecommunication and data transmission applications. A new method of
connecting optical fibers has been developed by "keying" a noncircular V-shaped optical fiber (V-fiber) into a silicon V-groove. In this interconnect the two resulting planes of contact provide enhanced lateral and rotational fiber alignment in comparison with conventional circular cross-section optical fiber and reduce the quantity of coupling agent required. The strength of the fibers and interconnects was evaluated by mechancal adhesion tests. Although the intrinsic V-fiber strength was less than that of conventional circular fibers, fiber/interconnect alignment was improved. Adhesion testing of interconnects indicated that V-fiber strength was the primary factor influencing interconnect strength. Low-light-loss splicing of V-fibers to conventional fibers has been demonstrated and allows circular fibers to be joined to V-fibers at interconnect points where improved alignment is required. V-fiber to V-groove interconnects have potential applications in multiple, birefringent, or small diameter core optical fibers.