We have developed a unique resist stabilization process for double patterning that uses 172 nm UV curing to 'freeze' a first photoresist pattern prior to application and patterning of a second photoresist film. 172 nm cure offers many potential advantages over other resist stabilization processes, including improved pattern fidelity vs. other cure processes and track-based implementation scenarios that are relatively simple, compact, and inexpensive. Assessment of 172 nm double imaging process requirements and limitations indicates that pattern distortions in the 'frozen' first photoresist may arise during all 2nd patterning steps, including coating, exposure, and development. Careful optimization to maximize overall pattern fidelity is needed. Process optimization using a conventional 193 nm photoresist suggests that pattern freeze approaches based on resist cure are best suited to extremely regular structures due to line-end and other resist distortions. Nevertheless, the method allows cross-grid contact printing at lithographic k1 = 0.385.
Demanding sub-45 nm node lithographic methodologies such as double patterning (DPT) pose significant challenges for
overlay metrology. In this paper, we investigate scatterometry methods as an alternative approach to meet these stringent
new metrology requirements. We used a spectroscopic diffraction-based overlay (DBO) measurement technique in
which registration errors are extracted from specially designed diffraction targets for double patterning. The results of
overlay measurements are compared to traditional bar-in-bar targets. A comparison between DBO measurements and
CD-SEM measurements is done to show the correlation between the two approaches. We discuss the total measurement
uncertainty (TMU) requirements for sub-45 nm nodes and compare TMU from the different overlay approaches.
We describe methods to determine transfer functions for line edge roughness (LER) from the photoresist pattern through
the etch process into the underlying substrate. Both image fading techniques and more conventional focus-exposure
matrix methods may be employed to determine the dependence of photoresist LER on the image-log-slope (ILS) or
resist-edge-log-slope (RELS) of the aerial image. Post-etch LER measurements in polysilicon are similarly correlated to
the ILS used to pattern the resist. From these two relationships, a transfer function may be derived to quantify the
magnitude of LER that transfers into the polysilicon underlayer from the photoresist.1
A second transfer function may be derived from power spectral density (PSD) analysis of LER. This approach is
desirable based on observations of pronounced etch smoothing of roughness in specific spatial frequency ranges.
Smoothing functions and signal averaging of large numbers of line edges are required to partially compensate for large
uncertainties in fast-Fourier transform derived PSDs of single line edges. An alternative and promising approach is to
derive transfer functions from PSDs estimated using autoregressive algorithms.
This paper discusses the use of scatterometry for scanner focus control in hyper-NA lithography. A variety of techniques
based on phase shift technology have been traditionally used to monitor scanner focus. Recently scatterometry has
offered significant promise as an alternate technique to monitor both focus and dose. In this study, we make careful
comparisons of a Scatterometry-based Focus-Dose Monitoring (SFDM) technique to Phase-grating Focus Monitoring
(PGFM). We discuss the operating principles of these techniques and compare the sensitivity of SFDM to PGFM. In
addition, the variation observed in characterizing intra-field and across-wafer behavior of a hyper-NA immersion
scanner is described when using these different techniques.
Scatterometry techniques are used to characterize the CD uniformity, focus and dose control, as well as the image
contrast of a hyper-NA immersion lithography scanner. Results indicate very good scanner control and stability of these
parameters, as well as good precision and sensitivity of the metrology techniques.
KEYWORDS: Line edge roughness, Polymers, Diffusion, Data modeling, Optical lithography, Image quality, Systems modeling, Photoresist materials, Chemical analysis, Scanning electron microscopy
Line edge roughness (LER) and intrinsic bias of 193-nm photoresist based on two methacrylate polymers are evaluated over a range of base concentration. Roughness is characterized as a function of the image log slope of the aerial image, the gradient in photoacid concentration, and the gradient in polymer protecting groups. Use of the polymer protection gradient as a characteristic roughness metric accounts for the effects of base concentration. Results demonstrate that a methacrylate terpolymer exhibits an advantage over the copolymer resist by achieving lower roughness at smaller values for the polymer protection gradient, resulting in lower LER for patterning. Intrinsic bias is found to be a function of the concentration of base. Process window analysis demonstrates that a greater depth of focus can be achieved for resists with low intrinsic bias. However, a tradeoff in depth of focus with LER is found. Spectral analysis indicates resists with greater intrinsic bias exhibit greater correlation lengths. Systems with greater intrinsic bias demonstrate lesser roughness for patterned features, with a minimum roughness achieved at maximum intrinsic bias. Kinetics of deprotection are modeled to calculate the chemical contrast of each resist. Resists exhibiting the greatest chemical contrast are identified as materials that generate the least roughness.
A method is presented to determine a transfer function for line edge roughness (LER) from the photoresist pattern through the etch process into the underlying material, such as a polysilicon gate. The image fading technique was employed to determine the dependence of photoresist LER on the image-log-slope (ILS) of the aerial image. From this initial condition in resist, LER after the etch process was measured in polysilicon and related to the ILS used to pattern the resist. From these two relationships, a transfer function could be derived to quantify the magnitude of LER that transfers into the polysilicon under layer from the photoresist. A gate layer type film stack and a 193nm resist system were employed. Results demonstrated that photoresist LER did transfer through the etch process. Increasing the resist LER increased the post-etch LER in polysilicon, and accordingly, minimizing resist LER minimized polysilicon LER. The etch process can reduce the magnitude of roughness in polysilicon over a range of mid and low spatial frequencies, however the extent of the roughness reduction diminishes as the resist LER reaches its minimum at large values of the ILS. In addition, resist trim rates during etch were apparently increased when LER of the resist was large. These results demonstrate that post-etch LER in polysilicon may be limited by the minimum LER achievable in resist, despite the occurrence of apparent smoothing mechanisms through the etch process.
As line edge roughness (LER) becomes one of the critical lithography challenges, there is a growing interest in applying surface conditioner solutions during post-develop process to reduce LER. In this paper, we evaluated the combined effect of surface conditioners and hard bake on the post-develop LER. There is about 1nm LER reduction, as well as a significant improvement on the common process window for LER. No negative impact on CD process window was observed with the new process. In addition, preliminary etch data showed that surface conditioners have no negative impact on pattern transfer through etch.
We have developed and proven the viability of a system for massively parallel in-situ sampling of aerial images at the actual wafer plane of a 193nm production scanner, using a wafer-like high-resolution image sensor. The sensor and scanner can be operated under exact production conditions in terms of projection optics, all illumination conditions, laser wavelength and bandwidth, so that the sensor will be sensitive to all effects arising from the interaction of an actual scanner with an actual reticle. We demonstrate the basic image capturing operation of the sensor, using more than 400,000 sampling points across the exposure field, and fundamental capabilities of the system. These include generation of focus maps, line width measurements on the sensor images, sensitivity to sub-resolution features, sensitivity to aberrations, and excellent agreement between experimental data and simulation.
In this work, we demonstrate a resolution enhancement technique for DUV lithography in which the light source spectrum is modified in order to improve the imaging performance of given device patterns. With this technique, termed RELAX, the imaging depth of focus (DOF) can be improved significantly for contact holes, and potentially line-space patterns. The improvement in the DOF comes at the expense of modest deterioration of other process performance metrics, such as exposure latitude and exposure bias, due to reduced image contrast at best focus. Compared to the FLEX-based techniques, RELAX allows a continuum of tunable spectral conditions without the drawback of multiple exposure passes, which is especially critical for step-and-scan lithography. Spectrum modification is accomplished by replacing the line narrowing and wavemeter modules of the excimer laser light source with RELAX-enabled modules. Direct wavefront modification of the laser output has been demonstrated to provide the optimum method for producing a double peak spectrum, which simulation has shown to produce the maximum DOF benefit. Results from imaging experiments of attenuated-PSM contact structures exposed using 248nm dipole illumination showed DOF improvements of up to 70% with a double peak separation of about 2pm. Lateral chromatic effects at this separation were negligible. These results agreed well with previous double exposure experiments1 and simulations of some of the design structures. The process improvements were obtained without a need for re-biasing of the mask structures, although a dose adjustment was required.
In this paper we present a method to characterize scattered light in lithography scanners based on the measurement of the modulation transfer function (MTF) of the lens. This method provides a description of scattered light at all length scales, or spatial frequencies, relevant to lithographic printing. We also introduce a new automated technique based on scatterometry that improves the precision and repeatability of the MTF measurement. Modeling of flare is important to quantify the impact of scattered light on the critical dimension of the features printed on chips. We have developed simulation methods based on actual data from our lithography scanners. Our model uses the MTF of the lens and the Fourier transform of the chip density map to calculate the flare distribution across the chips. We show that this approach is useful to understand how the characteristics of different scanners in our fabrication facilities might affect the critical dimension (CD) uniformity across our product chips.
Previous work has demonstrated the dependence of photoresist line edge roughness (LER) on the image-log-slope of the aerial image over a wide range of conditions; however, this relationship does not describe the influence of other factors such as photoresist composition or processing conditions on LER. This work introduces the concept of chemical gradients in the photoresist film rather than gradients in aerial image intensity as being a governing factor in the formation of photoresist LER. This concept is used to explain how differences in acid and base concentration in the photoresist lead directly to differences in observed LER. Numerous photoresist formulations were made over a wide range of compositions using 193 nanometer photoresist polymers as the basis. Experimental results coupled with results from simulation show that increasing the gradient of photoacid and hence increasing the gradient of protected polymer and the overall chemical contrast of the system reduces printed LER.
As critical dimensions in microlithography become ever smaller and the importance of line edge roughness becomes
more pronounced, it is becoming increasingly important to gain a fundamental understanding of how the chemical
composition of modern photoresists influences resist performance. Modern resists contain four basic components:
polymer, photoacid generator, dissolution inhibitor, and base quencher. Of these four components, the one that is least
understood is the base quencher. This paper examines the influence of base additives on line edge roughness, contrast,
photospeed, and isofocal critical dimension (CD). A mathematical model describing the tradeoff between contrast and
photospeed is developed, line edge roughness values for different base types and loadings are reported, and isofocal CD
is shown for various photoacid types as well as for different base types and loadings.
A technique was developed to investigate the role of aerial image contrast and image-log-slope (ILS) on the resulting magnitude of line edge roughness (LER) in resist with the goal of determining if the minimization of LER in current state-of-the-art, chemically amplified resist materials was limited by the quality of the projected aerial image or the materials and processing of the resist. The process of image fading was employed as the vehicle for controlled aerial image degradation. By reducing the quality of the aerial image through fading, the image contrast and ILS were decreased in a well-controlled and predictable manner, resulting in increased magnitude of LER. The link between experiment and simulation was made possible by the identification of the iso-fading condition, which in analogy to the iso-focal dose, results in a unique exposure dose for which the critical dimension (CD) of a resist feature does not change with increasing levels of fading. At the iso-fading condition, experimentally measured values for LER were analyzed as a function of the contrast and ILS of the aerial image used for patterning. It was determined that contrast was a poor predictor of the magnitude of LER though variations in feature type or illumination. The change in LER as a function of the ILS, however, produced a common basis for the comparison of LER through variations in line width, pitch, fading, increased background level of light, and illumination conditions. To include the effects of exposure dose on the resulting LER of resist features, the experimentally measured analog of the ILS, the resist edge-log-slope (RELS), was also used to produce a common curve for the evaluation of resist LER. Although overexposure can be used to further increase the ILS of the aerial image at the edge of the printed feature, the magnitude of 3σ LER in PAR735 resist appeared to be limited to a value of approximately 5.0nm in the limit of infinite RELS. This suggested that while the aerial image plays a strong role on determining the magnitude of LER during resist printing, there also exists a fundamental limitation to LER from the resist materials that cannot be improved by further increase in the quality of the aerial image.
The impact of wafer and reticle anti-reflection coatings (ARCs) on the aerial image of ArF lithography scanners is measured using contrast curves and critical dimension (CD) analysis. The importance of a good ARC layer on the wafer appears to be greater than that of the reticle-ARC. In fact, for state-of-the-art lithography scanners, the influence of the reticle-ARC is practically undetectable. Numerical simulations are used to understand the relative contributions of the lens, the wafer and the reticle to the overall loss of contrast associated with non-optimized ARCs.
A Phase-Grating Focus Monitor (PGFM) is used to assess the focus control of a state-of-the-art lithography scanner (TWINSCAN AT:1100) over substrate topography. The starting wafer flatness quality is found to be critical in minimizing the overall defocus distribution. In fact, on nearly all wafers, the most significant contributor to defocus across the wafer was the small-scale topography. Results obtained over programmed topography, created by etching various patterns into silicon, are found to agree well with the simulated defocus behavior based on the measurement of the wafer surface obtained on the scanner metrology stage. Finally, we report on preliminary focus control results over realistic device-type substrate topography, involving thin-film and polish effects.
We present here a procedure to characterize focus behavior on a first generation prototype 193-nm scanner using phase-shift focus monitors, which clearly identifies the influence of full field dynamic effects and that of the wafer topography and flatness. These results are used to correct the systematic errors due to incorrect tool set-up and show that proposed procedure has capability to identify focus errors and on this basis to construct a focus budget for all components: reticle, wafer, tool. We also present results using a new focus monitor based on phase gratings, which is more sensitive than the traditional phase-shift focus monitor.
We present a complete method for the characterization and modeling of flare based on the measurement of the modulation transfer function (MTF) of scanners. A point-spread function (PSFscat) representing only the scattered light or flare in the tool is inferred by comparing the measured MTF with a calculated MTF for aberration-free imaging. This PSFscat is then used to predict the effect of flare for different layouts. In particular, local variations in pattern density are shown to couple with mid- and short-range flare and lead to significant CD non-uniformity across the field. Finally, we examine double exposure techniques that are sensitive to flare because of the total light reaching the wafer, from the two masking steps.
The continuing demand to decrease device feature dimensions has put pressure on trying to minimize the levels of aberrations in today's lithographic lenses. Though the lenses that are currently used in the most advanced lithography tools have less aberrations than any preceding generations, the impacts of these aberrations are greater because of the smaller geometries being printed. In addition, most of the resolution enhancement techniques (RET), such as phase-shifting masks (PSM) and off-axis illumination (OAI), that have been reported to extend the resolution limit and increase the depth-of-focus (DOF) of optical lithography provide less immunity to aberrations than conventional approaches. Recently, concern has been surfaced from the implications of spherical aberration on printable features. Best focus position shift and isofocal tilt are one of the well known phenomena resulted from spherical aberration. By varying the reticle height, we observed a decrease in the effect of spherical aberration. In this paper, we explore various techniques that provide us a way of measuring spherical aberration. And we also develop a way to correct the spherical aberration without modifying projection optics.
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