Ms. Anka Birnstein Profile

Anka Birnstein

at Advanced Mask Technology Center GmbH & Co. KG

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Author

Publications (4)

Proceedings Article | 27 June 2019 Paper

The study of relationship between defect sensitivity and inspectability on EUV masks with 19x nm mask inspection

Masashi Yonetani, Karen Badger, Jed Rankin, Shinji Akima, Yusuke Toda, Itaru Yoshida, Masayuki Kagawa, Takeshi Isogawa, Yutaka Kodera, Jan Heumann, Anka Birnstein

Proceedings Volume 11178, 111780D (2019) https://doi.org/10.1117/12.2537430

KEYWORDS: Inspection, Extreme ultraviolet, Defect inspection, Photomasks, Opacity, Optical inspection, Signal detection, Critical dimension metrology, Extreme ultraviolet lithography, Defect detection

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Proceedings Article | 12 October 2018 Presentation

Minimizing tone reversal during 19x nm mask inspection: PMJ18 Best Paper (Conference Presentation)

Masashi Yonetani, Kazunori Seki, Karen Badger, Anka Birnstein, Jan Heumann, Takeshi Isogawa, Toshio Konishi, Yutaka Kodera

Proceedings Volume 10810, 1081007 (2018) https://doi.org/10.1117/12.2503808

KEYWORDS: Inspection, Photomasks, Extreme ultraviolet, EUV optics, Extreme ultraviolet lithography, Lithography, Semiconducting wafers, Wafer-level optics, Defect detection, Optical inspection

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Proceedings Article | 12 June 2018 Paper

Minimizing "Tone Reversal" during 19x nm mask inspection

Kazunori Seki, Karen Badger, Masashi Yonetani, Anka Birnstein, Jan Heumann, Takeshi Isogawa, Toshio Konishi, Yutaka Kodera

Proceedings Volume 10807, 108070D (2018) https://doi.org/10.1117/12.2502006

KEYWORDS: Inspection, Photomasks, Extreme ultraviolet, Polarization, Opacity, Defect detection, EUV optics, Deep ultraviolet, Defect inspection, Critical dimension metrology

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Proceedings Article | 16 March 2009 Paper

Multiple layer CD control treatment

Anka Birnstein, Christoph Röpke, Martin Sczyrba, Rainer Pforr, Mario Hennig, Guy Ben-Zvi, Erez Graitzer, Avi Cohen

Proceedings Volume 7274, 727422 (2009) https://doi.org/10.1117/12.814123

KEYWORDS: Signal attenuation, Photomasks, Semiconducting wafers, Critical dimension metrology, Scanners, Multilayers, Objectives, Deep ultraviolet, Lenses, Chemical elements

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