In recent years, due to harsh working environments, increased accuracy requirements, and limited fiber optic technology levels, the active all-fiber optical current transformer (FOCT) used in the power grid of China State Grid is equipped with optical power compensation modules and modulation voltage compensation modules. However, aging of the light source (10 years) and extremely low temperature (-40℃) can cause the compensation modules to fail, resulting in decreased measurement reliability and significant losses to the power grid system. In this paper, by simulating the working status of FOCT when the power source ages and the modulator function deteriorates, it is found that the second harmonic and phase modulation depth are parameters that can timely reflect the working status of the optical power compensation module and the modulation voltage compensation module. This provides reference for the monitoring of feedback FOCT and helps improve the stability of feedback FOCT.
In order to reduce the active region temperature of single core semiconductor lasers and improve the reliability of packaging devices, based on the COS packaging form, this work conducted heat dissipation analysis on the established "sandwich" structure and composite stacked structure semiconductor laser models. The flip chip packaging structure was optimized, Graphene film was used to increase the transverse heat dissipation channel of semiconductor laser, and the longitudinal heat conduction was carried out in combination with the heat dissipation copper sheet. Finally, the structural model of Graphene composite heat sink was established using SolidWorks software. By using ANSYS finite element software for steady-state thermal analysis comparison, the goal of reducing the temperature and thermal stress in the active region of semiconductor lasers was achieved. The proposed composite heat sink model can provide a design idea and method for high reliability laser packaging structures.
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