High-speed operation of free-space optical interconnect for a three-dimensional optoelectronic crossbar switching has been analyzed. System architecture, transmitter and receiver design are presented. The effect of ghost talk caused by the superposition of the delayed reflections of the original signal due to the multiple propagation of the wave between the vertical-cavity surface-emitting laser (VCSEL) and metal-semiconductor-metal (MSM) detector has been analyzed. The study indicates that even in the presence of significant amount of ghost talk a high performance free-space optical interconnect can be realized in this system by employing a receiver architecture that allows for DC level adjustment of the signal at the input of the transimpedance amplifier stage.
A hybrid scalable optoelectronic crossbar switching system that uses global parallel free-space optical interconnects and three-dimensional (3D) VLSI chip stacks is presented. The system includes three 3D chip stacks with each consisting of 16 VLSI chips. A single 16 X 16 VCSEL/MSM detector array is flip-chip bonded on top of the chip stack. Each chip supports 16 optical I/Os at 1 Gb/s. For the free-space optical interconnection between the chip stacks, a novel folded hybrid micro/macro optical system with a concave reflection mirror has been designed. The optics module can provide a high resolution, large field of view, high link efficiency, and low optical crosstalk. It is also symmetric and modular. Off-the- shelf macro-optical components are used. The concave reflection mirror can significantly improve the image quality and tolerate a large misalignment of the optical components. Scaling of the macrolens can be used to adjust the interconnection length between the chip stacks. The optical system is analyzed based on ray-tracing and scalar diffraction theory. The impact of Ghost talk on high-speed optical interconnection is studied. For system packaging, only passive alignment is required. Optics and electronics are separated until final assembly step, and the optomechanic module can be removed and replaced. By using 3D chip stacks, commercially available optical components and simple passive packaging techniques, it is possible to achieve a high-performance optoelectronic switching system.
Large-scale computer and data-communication systems have reached a bottleneck in performance in recent years due to the limitations of electronic interconnections for data transfer. One potential solution is based on the use of optoelectronic device arrays for free space optical interconnects. In this paper, we present the design and implementation of a 16 X 16 3D distributed optoelectronic crossbar switch.
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