Dr. Jens Meinschien Profile

Dr. Jens Meinschien

Vice President Research and Development at LIMO GmbH

SPIE Involvement:

Author

Publications (15)

Proceedings Article | 4 March 2016 Paper

Paper

Reliability of high power laser diodes with external optical feedback

Dennis Bonsendorf, Stephan Schneider, Jens Meinschien, Jens Tomm

Proceedings Volume 9733, 973302 (2016) https://doi.org/10.1117/12.2205296

KEYWORDS: Semiconductor lasers, High power lasers, Reliability, Laser systems engineering, Semiconductors, Diodes, Optical semiconductors, Optical damage, Materials processing, Solid state lasers, Indium gallium arsenide, Near field optics, Reflectivity, Laser damage threshold, Waveguides

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Proceedings Article | 1 July 2015 Paper

Paper

Laser cutting metallic plates using a 2kW direct diode laser source

E. Fallahi Sichani, D. Hauschild, J. Meinschien, J. Powell, E. Assunção, J. Blackburn, A. Khan, C. Kong

Proceedings Volume 9657, 96570C (2015) https://doi.org/10.1117/12.2179475

KEYWORDS: Laser cutting, Aluminum, Semiconductor lasers, Oxygen, Copper, Nickel, Nitrogen, Surface roughness, Metals, Laser sources

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Proceedings Article | 13 March 2015 Paper

Paper

Power scaling of kW-diode lasers optimized for material processing applications

Stephan Schneider, Ihab Kardosh, Michael Voß, Sebastian Liebl, Jens Meinschien

Proceedings Volume 9348, 934808 (2015) https://doi.org/10.1117/12.2076265

KEYWORDS: Laser cutting, Metals, Semiconductor lasers, Head, Laser processing, Materials processing, Laser applications, Absorption, Data modeling, High power diode lasers

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Proceedings Article | 22 February 2011 Paper

Paper

Concept and experimental implementation of a scalable high power and highly homogeneous laser line generator for industrial applications

M. Brodner, A. Bayer, J. Meinschien

Proceedings Volume 7918, 79180Y (2011) https://doi.org/10.1117/12.875733

KEYWORDS: Semiconductor lasers, High power diode lasers, Beam shaping, Collimation, Laser applications, High power lasers, Fiber coupled lasers, Fiber couplers, Patents, Optical design

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Proceedings Article | 25 February 2009 Paper

Paper

Optimizing laser beam profiles using micro-lens arrays for efficient material processing: applications to solar cells

Dirk Hauschild, Oliver Homburg, Thomas Mitra, Mikhail Ivanenko, Manfred Jarczynski, Jens Meinschien, Andreas Bayer, Vitalij Lissotschenko

Proceedings Volume 7202, 72020U (2009) https://doi.org/10.1117/12.809270

KEYWORDS: Beam shaping, Laser sources, Gaussian beams, Laser processing, Silicon, Solar cells, Annealing, Micromachining, Materials processing, Semiconductor lasers

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Proceedings Article | 24 February 2009 Paper

Paper

Automated assembly of fast-axis collimation (FAC) lenses for diode laser bar modules

Jörn Miesner, Andre Timmermann, Jens Meinschien, Bernhard Neumann, Steve Wright, Tolga Tekin, Henning Schröder, Thomas Westphalen, Felix Frischkorn

Proceedings Volume 7198, 71980G (2009) https://doi.org/10.1117/12.809190

KEYWORDS: Cameras, Semiconductor lasers, Image processing, Micro optics, Imaging systems, Laser systems engineering, Collimation, Near field, Optical components, Ultraviolet radiation

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Proceedings Article | 24 February 2009 Paper

Paper

Improvements of high-power diode laser line generators open up new application fields

J. Meinschien, A. Bayer, P. Bruns, L. Aschke, V. Lissotschenko

Proceedings Volume 7198, 71980N (2009) https://doi.org/10.1117/12.809574

KEYWORDS: Semiconductor lasers, Beam shaping, High power diode lasers, Laser applications, Laser cutting, Silicon, Laser processing, Glasses, Micro optics, Annealing

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Proceedings Article | 24 February 2009 Paper

Paper

Intensity increasing up to 4 MW/cm2 with BALB's via wavelengths coupling

Andre Timmermann, Daniel Bartoschewski, Stephan Schlüter, Colin Burke, Jens Meinschien

Proceedings Volume 7198, 71980X (2009) https://doi.org/10.1117/12.807430

KEYWORDS: Semiconductor lasers, Diodes, Laser cutting, Laser marking, Laser applications, Micro optics, Beam shaping, Metals, Polarization, Laser welding

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Proceedings Article | 12 September 2008 Paper

Paper

Beam shaping of line generators based on high power diode lasers to achieve high intensity and uniformity levels

A. Bayer, J. Meinschien, T. Mitra, M. Brodner

Proceedings Volume 7062, 70620X (2008) https://doi.org/10.1117/12.794943

KEYWORDS: Beam shaping, High power diode lasers, Collimation, Diffraction, Diodes, Micro optics, Crystals, Optical design, Lens design, Amorphous silicon

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Proceedings Article | 26 February 2008 Paper

Paper

Line length scalable high power diode laser with power densities > 100kw/cm2 for industrial Si-annealing applications

Markus Revermann, Andreas Bayer, Jens Meinschien

Proceedings Volume 6879, 68790R (2008) https://doi.org/10.1117/12.762956

KEYWORDS: Semiconductor lasers, Annealing, Crystals, Laser development, High power diode lasers, Laser crystals, Optical simulations, Collimation, Micro optics, Thin films

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Proceedings Article | 25 February 2008 Paper

Paper

Highly efficient fiber coupling of laser diode bars with > 50% electro-optical efficiency out of the fiber core

Udo Fornahl, Markus Revermann, Jens Meinschien

Proceedings Volume 6876, 68760X (2008) https://doi.org/10.1117/12.762516

KEYWORDS: Semiconductor lasers, Laser systems engineering, Fiber couplers, Fiber lasers, Fiber coupled lasers, Beam shaping, Reliability, Electro optics, Micro optics, Optical fibers

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Proceedings Article | 25 February 2008 Paper

Paper

Beam shaping of high power diode lasers benefits from asymmetrical refractive micro-lens arrays

O. Homburg, A. Bayer, T. Mitra, J. Meinschien, L. Aschke

Proceedings Volume 6876, 68760B (2008) https://doi.org/10.1117/12.762892

KEYWORDS: Beam shaping, High power diode lasers, Homogenization, Semiconductor lasers, Lenses, Laser sources, Manufacturing, Laser processing, High power lasers, Semiconductors

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Proceedings Article | 25 February 2008 Paper

Paper

Next generation high-brightness diode lasers offer new industrial applications

Andre Timmermann, Jens Meinschien, Peter Bruns, Colin Burke, Daniel Bartoschewski

Proceedings Volume 6876, 68760U (2008) https://doi.org/10.1117/12.763918

KEYWORDS: Semiconductor lasers, Laser cutting, Diodes, Laser marking, Laser welding, Collimation, Micro optics, Laser applications, Beam shaping, Laser systems engineering

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So far, diode laser systems could not compete against CO₂-lasers or DPSSL in industrial applications like marking or cutting due to their lower brightness. Recent developments in high-brightness diode laser bars and beam forming systems with micro-optics have led to new direct diode laser applications. LIMO presents 400W output from a 200μm core fibre with an NA of 0.22 at one wavelength. This is achieved via the combination of newly designed laser diode bars on passive heat sinks coupled with optimized micro-optical beam shaping. The laser is water cooled with a housing size of 375mm x 265mm x 70mm. The applications for such diode laser modules are mainly in direct marking, cutting and welding of metals and other materials, but improved pumping of fibre lasers and amplifiers is also possible. The small spot size leads to extremely high intensities and therefore high welding speeds in cw operation. For comparison: The M² of the fibre output is 70, which gives a comparable beam parameter product (22mm*mrad) to that of a CO₂ laser with a M² of 7 because of the wavelength difference. Many metals have a good absorption within the wavelength range of the laser diodes (NIR, 808nm to 980nm), which permits the cutting of thin sheets of aluminium or steel with a 200W version of this laser. First welding tests show reduced splatters and pores owing to the optimized process behaviour in cw operation with short wavelengths. The availability of a top-hat profile proves itself to be advantageous compared to the traditional Gaussian beam profiles of fibre, solid-state and gas lasers in that the laser energy is evenly distributed over the working area. For the future, we can announce an increase of the output power up to 1200W out of a 200μm fibre (0.22 NA). This will be achieved by further sophistication and optimisation of the coupling technique and the coupling of three wavelengths. The beam parameter product will then remain at 22mm*mrad with a power density of 3.8 MW/cm² if focussed to a 200µm spot. This leads to excellent laser cutting results with extremely small cutting kerfs down to 200μm and very plane cutting edges. Process speeds rise up to more than 10m/min i.e. for thin sheets of stainless steel or titanium.

Proceedings Article | 13 February 2008 Paper

Paper

Fiber-coupled air-cooled high-power diode laser systems

Daniel Bartoschewski, Jens Meinschien, Udo Fornahl

Proceedings Volume 6876, 68761M (2008) https://doi.org/10.1117/12.763199

KEYWORDS: Semiconductor lasers, Laser systems engineering, High power lasers, Diodes, Surgery, Continuous wave operation, Micro optics, Near field optics, Fiber coupled lasers, Resistance

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Current laser systems based on high-power laser diode bars need active cooling either water cooling or the use of thermo-electric coolers to ensure an adequate operating temperature for a reasonable lifetime. Here is a solution with a bonded fin heat sink and forced ventilation introduced, a diode laser bar with an improved efficiency and a low thermal resistance as well as an optical system for a highly efficient fibre coupling. With this system it is possible to couple 25 Watt continuous wave power from a single laser diode bar on a passive heat sink into a fibre with 200 μm core diameter. The basis for this performance is a heat sink with an exceptionally low thermal resistance. Several new features are introduced to reach a low overall gradient between the laser diode temperature and the ambient temperature. In addition, it does geometrically fit to the layout of the optical design. Shape and aspect ratio of both heat sink and housing of the laser system are matched to each other. Another feature is the use of hard-soldered or pressed bars to achieve a thermo-mechanically stable performance. The long-term thermal characteristic was tested. The operation temperature comes to saturation after about 30 minutes. Therefore it can be used for continuous wave operation at 25 Watt output power. At a quasi continuous operation at 70 percent duty cycle a peak power of 30 Watt out of the fibre is possible. From this technology results a compact fibre coupled laser system what is simple to drive compared with current high power laser systems, because there is no need to control the operating temperature. This gives way for more compact driver solutions. Fields of application are laser marking systems and material processing, where a simple driver system is requested. Also medical applications need this requirement and a compact cooling too so that mobile integrated solutions become possible. Further developments allow multiple laser diode systems for specific industrial applications demanding more power. Our measurements show the potential for direct air-cooled laser systems with 100 Watt power out of the fibre.

Proceedings Article | 7 February 2007 Paper

Paper

Efficient high-brightness diode laser modules offer new industrial applications

Markus Revermann, Andre Timmermann, Jens Meinschien, Peter Bruns

Proceedings Volume 6456, 64560Q (2007) https://doi.org/10.1117/12.700438

KEYWORDS: Semiconductor lasers, Fiber coupled lasers, Laser cutting, Fiber couplers, Laser marking, Collimation, Fiber lasers, Laser applications, Diodes, Micro optics

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Showing 5 of 15 publications

Conference Committee Involvement (3)

Components and Packaging for Laser Systems III

31 January 2017 | San Francisco, California, United States

Components and Packaging for Laser Systems II

16 February 2016 | San Francisco, California, United States

Components and Packaging for Laser Systems

9 February 2015 | San Francisco, California, United States

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