This course explains basic principles and applications of heterogeneous integration of Electrical IC (EIC) and Photonic IC (PIC) packaging. A primary goal of the course is to reveal the fundamental, design, materials, process, fabrication, and reliability of EIC and PIC packaging. Examples are taken from 3D stacking of EIC on PIC, heterogeneous integration of EIC and PIC with fan-out chip-last wafer-level flip-chip bonding method, to heterogeneous integration of EIC and PIC with through-silicon via (TSV)-interposer and fiber coupling method. Anyone who wants to answer questions such as, “how to build heterogeneous integration of EIC and PIC package?”, “how to stack EIC on PIC?”, “how to make microbump?”, “how to make fan-out package?”, “how to do flip chip packaging?”, or “how to make TSV-interposer?” will benefit from taking this course.