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Requirements for continuous improvement in performance, increasing miniaturization and density of systems are the main driver in the semiconductor industry to improve the structure of chips and develop new packaging principles. Installations that install semiconductor crystals are necessarily equipped with technical vision systems. These systems include two or more industrial video cameras. The cameras are connected to a powerful computer. Computer software recognizes the position of the crystals in the storage system, monitors and corrects the error in the position of the crystal during transfer and flip operations, recognizes the mounting point of the crystal on the substrate and determines the correctness of the operation in order to identify defects.
The article discusses a technical vision system for an automatic installation of semiconductor crystals. The requirements for cameras are justified and calculated based on the required chip positioning accuracy. A description of the applied technical vision algorithms and the final software product is given.
The effectiveness test was carried out on a set of test images obtained by the flip chip machine, images by a microcircuit analyzer, as well as data from the product production line. The analyzation frames had low resolution and poor lighting. Images are captured in RGB color space.
The research described in this article demonstrates the significant potential for automation and optimization in the context of microchip analysis processes. Automated analysis systems can eliminate the need for manual labor, leading to increased efficiency, accuracy, and consistency.
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