KEYWORDS: Single crystal X-ray diffraction, Critical dimension metrology, Semiconducting wafers, Scanning electron microscopy, Process control, Spectroscopy, Spectroscopes, Metrology, Precision measurement, Control systems
Smaller device dimensions and tighter process control windows have created a need for CD metrology tools having higher levels of precision and accuracy. Furthermore, the need to detect and measure changes in feature profiles is becoming critical to in-line process control and stepper evaluation for sub-0.18micrometers technology. Spectroscopic CD (SCDTM) is an optical metrology technique that can address these needs. This work describes the use of a spectroscopic CD metrology tool to measure and characterize the focus and exposure windows for the process. The results include comparison to the established in-line CD-SEM, as well as a cross-section SEM. Repeatability and long-term stability data form a gate level nominal process are also presented.
A joint Motorola/IBM experiment was performed in mix-and-match lithography across widely separated locations. A simple pattern placement metrology data set was created, and x-ray masks were manufactured according to this data. The same data was converted into a 5x reticle and optically stepped on wafers. The x-ray mask was designed to print upon two optical fields with one x-ray exposure. The x-ray mask was aligned to the wafers to produce box-in- box images for overlay metrology. The main overlay problems encountered were systematic offsets between x-ray and optical images, and average magnification error of approximately 8 ppm. The magnification error is substantial because of the 3 degree(s)C temperature difference between the optical stepper stage and the x-ray mask-writer. In an actual device run, the magnification differences will be removed by compensation in the e-beam writing of the x-ray mask. Offsets will be removed by use of a send-ahead wafer to determine the correct offset alignment in the x-ray stepper.
Systematic offset errors can be a major contributor to total overlay error on projection wafer steppers. To compensate for this offset error we have developed an automated method using measured overlay results from previous lots to generate offset correction values for current lots. This method provides statistically optimized offset corrections while eliminating the need to process test wafers. In addition the dynamic correction capability of the feedback control loop automatically compensates for offset changes such as drift in stepper alignment systems, process modification, and mask revisions. The system has been in use for over a year and has proven extremely effective in eliminating systematic offset errors on numerous devices.
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