Dr. Ping Zhang Profile

Dr. Ping Zhang

MEMS Engineer at Glimmerglass Networks Inc

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Author

Publications (8)

Proceedings Article | 5 February 2010 Paper

Performance and reliability assessment of a dielectric charging guard in MEMS optical switch systems

Ping Zhang, Emily Carr, Doug Keebaugh, Kelvin Chau

Proceedings Volume 7592, 75920Z (2010) https://doi.org/10.1117/12.851714

KEYWORDS: Electrodes, Mirrors, Microelectromechanical systems, Optical switching, Dielectrics, Oxides, Reliability, Silicon, Switching, Micromirrors

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Proceedings Article | 19 February 2009 Paper

Cost-effective method of manufacturing a 3D MEMS optical switch

Emily Carr, Ping Zhang, Doug Keebaugh, Kelvin Chau

Proceedings Volume 7204, 720402 (2009) https://doi.org/10.1117/12.810065

KEYWORDS: Semiconducting wafers, Microelectromechanical systems, Optical switching, Wafer bonding, Switches, Mirrors, Optics manufacturing, Seaborgium, Reliability, Epoxies

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Proceedings Article | 29 November 2007 Paper

An active interconnecting mechanism for free-space optic applications

Ping Zhang, Kevin Le, Lun-Chen Hsu, Praveen Pandojirao-Sunkojirao, Smitha Malalur-Nagaraja-Rao, J.-C. Chiao

Proceedings Volume 6836, 683604 (2007) https://doi.org/10.1117/12.757799

KEYWORDS: Mirrors, Micromirrors, Optical filters, Actuators, Semiconducting wafers, Dense wavelength division multiplexing, Free space optics, Microelectromechanical systems, Active optics, Silicon

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Proceedings Article | 8 January 2007 Paper

An active locking mechanism for assembling 3D micro structures

Ping Zhang, Mohammad Mayyas, Woo Ho Lee, Dan Popa, Panos Shiakolas, Harry Stephanou, J. Chiao

Proceedings Volume 6414, 641425 (2007) https://doi.org/10.1117/12.696181

KEYWORDS: Actuators, Deep reactive ion etching, Semiconducting wafers, Silicon, Photoresist materials, Microsystems, Materials processing, Metals, Photomasks, Scanning electron microscopy

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Microassembly is an enabling technology to build 3D microsystems consisting of microparts made of different materials and processes. Multiple microparts can be connected together to construct complicated in-plane and out-of-plane microsystems by using compliant mechanical structures such as micro hinges and snap fasteners. This paper presents design, fabrication, and assembly of an active locking mechanism that provides mechanical and electrical interconnections between mating microparts. The active locking mechanism is composed of thermally actuated Chevron beams and sockets. Assembly by means of an active locking mechanism offers more flexibility in designing microgrippers as it reduces or minimizes mating force, which is one of the main reasons causing fractures in a microgripper during microassembly operation. Microgrippers, microparts, and active locking mechanisms were fabricated on a silicon substrate using the deep reactive ion etching (DRIE) processes with 100-um thick silicon on insulator (SOI) wafers. A precision robotic assembly platform with a dual microscope vision system was used to automate the manipulation and assembly processes of microparts. The assembly sequence includes (1) tether breaking and picking up of a micropart by using an electrothermally actuated microgripper, (2) opening of a socket area for zero-force insertion, (3) a series of translation and rotation of a mating micropart to align it onto the socket, (4) insertion of a micropart into the socket, and (5) deactivation and releasing of locking fingers. As a result, the micropart was held vertically to the substrate and locked by the compliance of Chevron beams. Microparts were successfully assembled using the active locking mechanism and the measured normal angle was 89.2°. This active locking mechanism provides mechanical and electrical interconnections, and it can potentially be used to implement a reconfigurable microrobot that requires complex assembly of multiple links and joints.

Proceedings Article | 23 January 2006 Paper

Characterization of nonlinear optical polymers fabricated from dye doped UV curing epoxy

Kevin Le, Ping Zhang, Hans Hu, J.-C. Chiao

Proceedings Volume 6109, 61090N (2006) https://doi.org/10.1117/12.644423

KEYWORDS: Polymers, Nonlinear optics, Polymer thin films, Absorption, Ultraviolet radiation, Electrodes, Electro optics, Molecules, Epoxies, Quartz

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Proceedings Article | 23 January 2006 Paper

A polymer-based Fabry-Perot filter integrated with 3-D MEMS structures

Ping (Cerina) Zhang, Kevin Le, Smitha Malalur-Nagaraja-Rao, Lun-Chen Hsu, J.-C. Chiao

Proceedings Volume 6109, 610905 (2006) https://doi.org/10.1117/12.645076

KEYWORDS: Polymers, Microelectromechanical systems, Actuators, Fabry–Perot interferometers, Optical filters, Filtering (signal processing), Silicon, Optical components, Interfaces, Absorption

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Proceedings Article | 18 January 2006 Paper

Polymeric electro-optical channel waveguide fabricated by lithography and wet chemical etching

Kevin Le, Ping Zhang, Hans Hu, J.-C. Chiao

Proceedings Volume 6038, 60381Q (2006) https://doi.org/10.1117/12.638302

KEYWORDS: Polymers, Electro optic polymers, Nonlinear optics, Polymer multimode waveguides, Channel waveguides, Electro optics, Waveguides, Polymer thin films, Wet etching, Molecules

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Proceedings Article | 18 January 2006 Paper

Self-assembly micro optical filter

Ping Zhang, Kevin Le, Smitha Malalur-Nagaraja-Rao, Lun-Chen Hsu, J.-C. Chiao

Proceedings Volume 6038, 603820 (2006) https://doi.org/10.1117/12.638604

KEYWORDS: Polymers, Optical filters, Actuators, Microelectromechanical systems, Optics manufacturing, Optical components, Silicon, Interfaces, Fabry–Perot interferometers, Polymer thin films

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Showing 5 of 8 publications

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