Dr. Tzung-Te Chen Profile

Dr. Tzung-Te Chen

at Industrial Technology Research Institute

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Publications (5)

Proceedings Article | 9 March 2015 Paper

Study of failure mechanisms for InGaN light-emitting diode chips with patterned sapphire substrates

Chia-Hung Sun, Man-Fang Huang, Hsu-Han Yang, Fang-Ming Chen, Tzung-Te Chen

Proceedings Volume 9383, 93831J (2015) https://doi.org/10.1117/12.2079296

KEYWORDS: Light emitting diodes, Patterned sapphire substrate, Indium gallium nitride, External quantum efficiency, Sapphire, Reliability, Resistance, Gallium nitride, Failure analysis, Optoelectronics

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Proceedings Article | 30 September 2013 Paper

The low-frequency noise spectrum analysis of the reliability of the InGaN LED

Tzung-Te Chen, Chun-Fan Dai, Chun-Wen Chu, Han-Kuei Fu, Chien-Ping Wang, Pei-Ting Chou

Proceedings Volume 8835, 88350Z (2013) https://doi.org/10.1117/12.2026584

KEYWORDS: Light emitting diodes, Indium gallium nitride, Reliability, Scanning electron microscopy, Silica, Tolerancing, Transmission electron microscopy, Spectrum analysis, Failure analysis, Interfaces

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Proceedings Article | 30 September 2013 Paper

Evaluation of optical and chromatic properties under electrical and thermal coupling in solid state lighting systems

Han-Kuei Fu, Yi-Ping Peng, Chien-Ping Wang, Hsin-Chien Chiang, Tzung-Te Chen, Chiu-Ling Chen, Pei-Ting Chou

Proceedings Volume 8835, 88350Y (2013) https://doi.org/10.1117/12.2025366

KEYWORDS: Light emitting diodes, Resistance, Temperature metrology, Thermography, LED lighting, Colorimetry, Reliability, Solid state lighting, Light sources and illumination, Device simulation

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Proceedings Article | 18 August 2010 Paper

Assessment of ESD robustness in high power light emitting diodes

Shih-Chun Yang, Pang Lin, Han-Kuei Fu, Chien-Ping Wang, Tzung-Te Chen, An-Tse Lee, Sheng-Bang Huang, Pei-Ting Chou, Wei Wang, Fu-Jen Kao

Proceedings Volume 7784, 778419 (2010) https://doi.org/10.1117/12.860322

KEYWORDS: Light emitting diodes, Electroluminescence, Transmission electron microscopy, Failure analysis, Sapphire, Gallium nitride, Scanning electron microscopy, Diodes, Instrument modeling, Electronics

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Proceedings Article | 18 August 2010 Paper

Thermal transient characteristics of flip chip high power light emitting diodes

Chien-Ping Wang, Tzung-Te Chen, Shih-Chun Yang, Han-Kuei Fu, An-Tse Lee, Pei-Ting Chou, Chien-Jen Sun, Chiu-Ling Chen, Mu-Tao Chu

Proceedings Volume 7784, 77840T (2010) https://doi.org/10.1117/12.861083

KEYWORDS: Light emitting diodes, Resistance, Interfaces, Numerical simulations, Gold, Aluminum, Silver, Epoxies, Temperature metrology, Reliability

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