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Yeonho Pae
at KLA Corp
SPIE Involvement:
Author
Publications (3)
Proceedings Article | 20 March 2010 Paper
The analysis of EUV mask defects using a wafer defect inspection system
Kyoung-Yong Cho, Joo-On Park, Changmin Park, Young-Mi Lee, In-Yong Kang, Jeong-Ho Yeo, Seong-Woon Choi, Chan-Hoon Park, Steven Lange, SungChan Cho, Robert Danen, Gregory Kirk, Yeon-Ho Pae
Proceedings Volume 7636, 76361E (2010) https://doi.org/10.1117/12.846482
KEYWORDS: Semiconducting wafers, Photomasks, Line width roughness, Inspection, Wafer inspection, Scanning electron microscopy, Defect detection, Signal to noise ratio, Extreme ultraviolet lithography, Line edge roughness
Proceedings Article | 24 March 2009 Paper
Development of a novel methodology for effective partial die inspection and monitoring
Byoung-Ho Lee, Tae-Yong Lee, Andrew Cross, Masami Aoki, HeungSoo Choi, YeonHo Pae
Proceedings Volume 7272, 72723K (2009) https://doi.org/10.1117/12.813994
KEYWORDS: Inspection, Semiconducting wafers, Yield improvement, Defect inspection, Wafer inspection, Reticles, Signal processing, Electronics, Semiconductors, Contamination
Proceedings Article | 24 March 2009 Paper
Comparative study of process window identification methods for 45 nm device and beyond
HoSeong Kang, SooCheol Lee, MinHo Kim, KiHo Kim, YongTeak Jeong, YeonHo Pae, ChangHo Lee
Proceedings Volume 7272, 72723D (2009) https://doi.org/10.1117/12.814019
KEYWORDS: Finite element methods, Inspection, Scanning electron microscopy, Semiconducting wafers, Lithography, Wafer inspection, Modulation, Process control, Panoramic photography, Defect inspection
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