The checkerboard is a frequently used pattern in camera calibration, an essential process to get intrinsic parameters for more accurate information from images. An automatic checkerboard detection method that can detect multiple checkerboards in a single image is proposed. It contains a corner extraction approach using self-correlation and a structure recovery solution using constraints related to adjacent corners and checkerboard block edges. The method utilizes the central symmetric feature of the checkerboard crossings as well as the spatial relationship of neighboring checkerboard corners and the grayscale distribution of their neighboring pixels. Five public datasets are used in the experiments to evaluate the method. Results show high detection rates and a short average runtime of the proposed method. In addition, the camera calibration accuracy also presents the effectiveness of the proposed detection method with reprojected pixel errors smaller than 0.5 pixels.
A reflection TIE system consisting of a reflecting microscope and a 4f relay system is presented in this paper, with which the transport of intensity equation (TIE) is applied to reconstruct the three-dimensional (3D) profile of opaque micro objects like wafer structures for 3D inspection. As the shape of an object can affect the phases of waves, the 3D information of the object can be easily acquired with the multiple phases at different refocusing planes. By electronically controlled refocusing, multi-focal images can be captured and used in solving TIE to obtain the phase and depth of the object. In order to validate the accuracy and efficiency of the proposed system, the phase and depth values of several samples are calculated, and the experimental results is presented to demonstrate the performance of the system.
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