Spectroscopic vector analysis for fast pattern quality monitoring

Younghoon Sohn; Sungyoon Ryu; Chihoon Lee; Yusin Yang

doi:10.1117/12.2296448

13 March 2018 Spectroscopic vector analysis for fast pattern quality monitoring

Younghoon Sohn, Sungyoon Ryu, Chihoon Lee, Yusin Yang

Proceedings Volume 10585, Metrology, Inspection, and Process Control for Microlithography XXXII; 105851J (2018) https://doi.org/10.1117/12.2296448
Event: SPIE Advanced Lithography, 2018, San Jose, California, United States

Abstract

In semiconductor industry, fast and effective measurement of pattern variation has been key challenge for assuring massproduct quality. Pattern measurement techniques such as conventional CD-SEMs or Optical CDs have been extensively used, but these techniques are increasingly limited in terms of measurement throughput and time spent in modeling. In this paper we propose time effective pattern monitoring method through the direct spectrum-based approach. In this technique, a wavelength band sensitive to a specific pattern change is selected from spectroscopic ellipsometry signal scattered by pattern to be measured, and the amplitude and phase variation in the wavelength band are analyzed as a measurement index of the pattern change. This pattern change measurement technique is applied to several process steps and verified its applicability. Due to its fast and simple analysis, the methods can be adapted to the massive process variation monitoring maximizing measurement throughput.

Conference Presentation

Citation Download Citation

Younghoon Sohn, Sungyoon Ryu, Chihoon Lee, and Yusin Yang "Spectroscopic vector analysis for fast pattern quality monitoring", Proc. SPIE 10585, Metrology, Inspection, and Process Control for Microlithography XXXII, 105851J (13 March 2018); https://doi.org/10.1117/12.2296448

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