Presentation + Paper
27 February 2019 High speed and high power laser material processing: determination of process limits and exploration of new application fields
Jens Hildenhagen, Paul Bant
Author Affiliations +
Abstract
The increasing output power and brilliance of continuous wave (cw) laser sources allows faster material processes but needs novel handling technologies, e.g. beam guiding systems. Current developments like polygon scanner are dissolving consisting restrictions. Finally, physical properties (e.g. primary thermal conduction and heat capacity) will be the remaining limitations for process speed. A brief study should give an outlook what might be possible in the foreseeable future in the field of high speed laser material processing when the above listed technical limitations have been overcome. Therefore, different samples (bulk material as well as layer systems) were mounted on a fast rotating cylinder and treated with a 30 kW (cw) fiber laser. The high circumferential speed of 120 m/s leds to a short beam-material interaction time for each point on the surface and the immense power can be dispersed. The applied laser spot diameter of ~0.2-0.4 mm results in an interaction time about 2-4 μs and an intensity about 108 W/cm2. Such parameters are usually known by pulsed laser systems and would be used to enable distinct surface modifications or even single-pulse ablation. The descript test setup should transfer these applications into continuous processes and eliminate losses otherwise caused by duty cycle. Thus it was possible to remove oxide layer or other resistant coatings with an output of several square meters per minute.
Conference Presentation
© (2019) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jens Hildenhagen and Paul Bant "High speed and high power laser material processing: determination of process limits and exploration of new application fields", Proc. SPIE 10911, High-Power Laser Materials Processing: Applications, Diagnostics, and Systems VIII, 1091109 (27 February 2019); https://doi.org/10.1117/12.2507367
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Laser systems engineering

Laser processing

Thermal effects

Continuous wave operation

Fiber lasers

Materials processing

Laser ablation

RELATED CONTENT

Mechanisms of combined laser on damage effectiveness
Proceedings of SPIE (December 22 2022)
Throughput optimization for laser micro structuring
Proceedings of SPIE (March 04 2016)
Ultra short pulse delivery at high average power with low...
Proceedings of SPIE (February 17 2017)
Laser microstructuring of sapphire wafer and fiber
Proceedings of SPIE (February 16 2010)
Nd:YAG laser welding: an overview
Proceedings of SPIE (April 09 2003)
High repetition rate femtosecond laser processing of metals
Proceedings of SPIE (February 25 2010)

Back to Top