Ultra-thin benzocyclobutene bonding of InGaAs PIN photodetector onto silicon photonic chip

Yan Wang; Dongchen Wang; Pengxiao Xu; Guanghua Tang; Guoqing You; Yuechan Kong

doi:10.1117/12.2565318

17 April 2020 Ultra-thin benzocyclobutene bonding of InGaAs PIN photodetector onto silicon photonic chip

Yan Wang, Dongchen Wang, Pengxiao Xu, Guanghua Tang, Guoqing You, Yuechan Kong

Proceedings Volume 11455, Sixth Symposium on Novel Optoelectronic Detection Technology and Applications; 1145573 (2020) https://doi.org/10.1117/12.2565318
Event: Sixth Symposium on Novel Photoelectronic Detection Technology and Application, 2019, Beijing, China

Abstract

Ultro-thin benzocyclobutene（BCB）bonding process has been proposed as a solution of InGaAs/Si optoelectronic heterogeneous integration. Here, we present a process of InGaAs PIN photodetector bonding onto silicon photonic chip, an ultra-thin bonding layer below 400nm is applied. Silicon photonic chip was fabricated by CMOS compatible process. In order to importing and exporting the light, a focal grating coupler was designed and fabricated, and fiber-to-chip efficiency was 37.7%. InGaAs PIN photodetector responsivity was 0.95A/W which taped out on 3 inch standard InP process. The result presented that the responsivity deterioration coefficient was below 1dB, and the coupling efficiency from Si waveguide to InGaAs photodetector was 41.8%.

Citation Download Citation

Yan Wang, Dongchen Wang, Pengxiao Xu, Guanghua Tang, Guoqing You, and Yuechan Kong "Ultra-thin benzocyclobutene bonding of InGaAs PIN photodetector onto silicon photonic chip", Proc. SPIE 11455, Sixth Symposium on Novel Optoelectronic Detection Technology and Applications, 1145573 (17 April 2020); https://doi.org/10.1117/12.2565318

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