Resistless Microfabrication Of Cu Thin Films On N-Type GaAs By Projection Patterned Excimer Laser Doping

Koji Sugioka; Koichi Toyoda

doi:10.1117/12.963977

23 February 1990 Resistless Microfabrication Of Cu Thin Films On N-Type GaAs By Projection Patterned Excimer Laser Doping

Koji Sugioka, Koichi Toyoda

Author Affiliations +

Proceedings Volume 1190, Laser/Optical Processing of Electronic Materials; (1990) https://doi.org/10.1117/12.963977
Event: 1989 Microelectronic Integrated Processing Conferences, 1989, Santa Clara, United States

Abstract

Resistless microfabrication of Cu thin films on n-type GaAs by projection patterned laser doping using a KrF excimer laser and a SiH4 gas is described. Copper thin films with a linewidth as narrow as 2.35gm are deposited selectively on the doped region by electroplating in a CuSO4 aqueou solution. The resistivity of the deposited Cu films is evaluated to be 2.45x 10° S2cm, which is compared to that of bulk Cu. Using this technique, nonallpyed ohmic contacts can be formed with a specific contact resistance of 2.32x 10a S2 cm 4, which is one-thirtieth of that of the conventional alloyed contacts. The mechanism of Cu film deposition by electroplating is discussed.

Citation Download Citation

Koji Sugioka and Koichi Toyoda "Resistless Microfabrication Of Cu Thin Films On N-Type GaAs By Projection Patterned Excimer Laser Doping", Proc. SPIE 1190, Laser/Optical Processing of Electronic Materials, (23 February 1990); https://doi.org/10.1117/12.963977

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