Chip-to-chip optical interconnect using direct optical wire bonding

Hyun-Woo Rhee; Jong-Bum You; Jae-Yong Kim; Hyeonho Yoon; Myeongho Kim; Chong Cook Kim; Hyo-Hoon Park

doi:10.1117/12.2608472

5 March 2022 Chip-to-chip optical interconnect using direct optical wire bonding

Hyun-Woo Rhee, Jong-Bum You, Jae-Yong Kim, Hyeonho Yoon, Myeongho Kim, Chong Cook Kim, Hyo-Hoon Park

Proceedings Volume 12007, Optical Interconnects XXII; 120070F (2022) https://doi.org/10.1117/12.2608472
Event: SPIE OPTO, 2022, San Francisco, California, United States

Abstract

We present inter-chip optical link based on direct optical wire (DOW) bonding technology fabricated by meniscus-guided polymerization in open-air. The arch shape DOW structure is formed in a single procedure for directly linking silicon photonic chips, where grating couplers are integrated to out-couple guided optical modes. Although a typical grating coupler is employed, the inter-chip DOW link supports a low insertion loss of 6 dB in total with a wavelength-insensitive operation in the measured wavelength range of 1520 nm to 1590 nm. The half-arch shape DOW for linking chip-to-fiber is also shown to verify the feasibility of hybrid integration with edge coupling devices. DOW bonding technology can provide a convenient route to enable direct optical link capable of agile and high-throughput manufacturing for inter-chip optical interconnection.

Conference Presentation

Citation Download Citation

Hyun-Woo Rhee, Jong-Bum You, Jae-Yong Kim, Hyeonho Yoon, Myeongho Kim, Chong Cook Kim, and Hyo-Hoon Park "Chip-to-chip optical interconnect using direct optical wire bonding", Proc. SPIE 12007, Optical Interconnects XXII, 120070F (5 March 2022); https://doi.org/10.1117/12.2608472

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