Excimer laser dry etching of PDMS applied for microfluidic chips

Qian Li; Haiyan Zhang; Rongjing Li; Tao Chen

doi:10.1117/12.2638682

29 April 2022 Excimer laser dry etching of PDMS applied for microfluidic chips

Qian Li, Haiyan Zhang, Rongjing Li, Tao Chen

Proceedings Volume 12255, 2022 International Conference on Optoelectronic Information and Functional Materials (OIFM 2022); 122550A (2022) https://doi.org/10.1117/12.2638682
Event: 2022 International Conference on Optoelectronic Information and Functional Materials (OIFM 2022), 2022, Chongqing, China

Abstract

Laser dry etching using a 248 nm KrF excimer laser was investigated for polydimethylsiloxane (PDMS) chips surface irradiation. Examination of the morphology in relation to ablation depth was emphasized, and a heat conduction model of laser photothermal interaction with PDMS surface was established. The transmittance and absorbance of PDMS at 248nm were validated clearly using UV-vis spectrum measurements. The influence of laser pulse number on the ablation morphology and depth during dry etching was also analyzed. The results showed that with the increase of pulse number, the heat accumulation effect around the etched hole was obvious, and the ablation residue increased. The ablation depth also increased with the pulse number. When the pulse number was 200, the etching depth reached 36.8 μm. This work provides a feasible basis for laser direct etching of PDMS microfluidic chip channels and will promote the development of microfluidic chip fabrication.

Citation Download Citation

Qian Li, Haiyan Zhang, Rongjing Li, and Tao Chen "Excimer laser dry etching of PDMS applied for microfluidic chips", Proc. SPIE 12255, 2022 International Conference on Optoelectronic Information and Functional Materials (OIFM 2022), 122550A (29 April 2022); https://doi.org/10.1117/12.2638682

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