Dr. Qian Li Profile

Dr. Qian Li

at Beijing Univ of Technology

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Publications (2)

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Proceedings Article | 9 March 2023 Paper

Study on ablation properties of PDMS by 193 nm and 248 nm excimer laser

Haiyan Zhang, Xiaojing Zhang, Qian Li, Tao Chen

Proceedings Volume 12600, 126000Q (2023) https://doi.org/10.1117/12.2674122

KEYWORDS: Laser ablation, Polydimethylsiloxane, Excimer lasers, Pulsed laser operation, Laser energy, Laser processing, Optical microscopes, Light absorption, Etching, Ultraviolet radiation

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Laser direct writing technology was a convenient and efficient method in micromachining, which was widely used in polymer processing. In this paper, two kinds of excimer laser (193 nm and 248 nm) were used to irradiate vertically the surface of polydimethylsiloxane (PDMS) for ablation experiments. The experiments were carried out in atmospheric environment, and the ablated samples were characterized by optical microscope, laser confocal microscope, white light interferometer, scanning electron microscope, etc. to obtain their morphology. Analysis was performed on the effects of laser energy and pulse numbers on depth, roughness, and morphology. The outcomes demonstrated that, the crater depth and roughness increased as the number of pulses and energy increased, but that the bottom surface's roughness did not continuously increased with the ablation of a 248 nm laser. At low energy, the roughness remained constant as the number of pulses increased. When the laser operating voltage was adjusted to 23 kV, the roughness increased linearly with the number of pulses. As the laser energy and the number of pulses increased, the number of splashes deposited on the ablation surface increased. Cracks were generally observed across the PDMS surface after a 248 nm laser and the crater edges were rough. The morphology in the 193nm laser ablation showed better micromachining quality, reflected in a small number of pores, sharp edges, and smoother bottom surface.

Proceedings Article | 29 April 2022 Paper

Excimer laser dry etching of PDMS applied for microfluidic chips

Qian Li, Haiyan Zhang, Rongjing Li, Tao Chen

Proceedings Volume 12255, 122550A (2022) https://doi.org/10.1117/12.2638682

KEYWORDS: Dry etching, Excimer lasers, Numerical simulations

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Laser dry etching using a 248 nm KrF excimer laser was investigated for polydimethylsiloxane (PDMS) chips surface irradiation. Examination of the morphology in relation to ablation depth was emphasized, and a heat conduction model of laser photothermal interaction with PDMS surface was established. The transmittance and absorbance of PDMS at 248nm were validated clearly using UV-vis spectrum measurements. The influence of laser pulse number on the ablation morphology and depth during dry etching was also analyzed. The results showed that with the increase of pulse number, the heat accumulation effect around the etched hole was obvious, and the ablation residue increased. The ablation depth also increased with the pulse number. When the pulse number was 200, the etching depth reached 36.8 μm. This work provides a feasible basis for laser direct etching of PDMS microfluidic chip channels and will promote the development of microfluidic chip fabrication.

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