Paper
4 November 2024 Influence of bonding properties at the NiTi-SMA wire/epoxy resin interface
Chunling Lu, Xiao Gan, Shiyuan Du, Qiang Wang
Author Affiliations +
Proceedings Volume 13420, Third International Conference on New Materials, Machinery, and Vehicle Engineering (NMMVE 2024); 134200R (2024) https://doi.org/10.1117/12.3054952
Event: International Conference on New Materials, Machinery, and Vehicle Engineering 2024, 2024, Dalian, China
Abstract
To study the influence of various factors on the interfacial bonding performance between nickel-titanium shape memory alloy (NiTi-SMA) wire and epoxy resin. The bonding strength of the SMA wire/epoxy resin interface was determined by SMA wire pull-out tests, focusing on the effects of adhesive type and SMA wire bonding length on the interface failure mode and bonding strength. The results indicate that the failure mode of Sikadur-330 CN and Lica-102 is interfacial bonding failure between SMA wire and epoxy resin, and the effective bonding length is between 2.0 cm and 3.0 cm. The epoxy impregnated resin Sikadur-330 CN exhibits the best bonding performance. This study can provide theoretical support for the design, preparation, and practical engineering application of FRP/SMA composite materials.
© (2024) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chunling Lu, Xiao Gan, Shiyuan Du, and Qiang Wang "Influence of bonding properties at the NiTi-SMA wire/epoxy resin interface", Proc. SPIE 13420, Third International Conference on New Materials, Machinery, and Vehicle Engineering (NMMVE 2024), 134200R (4 November 2024); https://doi.org/10.1117/12.3054952
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KEYWORDS
Shape memory alloys

Interfaces

Adhesives

Epoxies

Colloids

Materials properties

Composite resins

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