CAD in new areas of the package and interconnect design space

Dennis J. McBride

doi:10.1117/12.25587

1 April 1991 CAD in new areas of the package and interconnect design space

Dennis J. McBride

Proceedings Volume 1390, Microelectronic Interconnects and Packages: System and Process Integration; (1991) https://doi.org/10.1117/12.25587
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States

Abstract

Passive interconnection networks are important for three reasons. First they represent an increasing percentage of the cycle time as the active devices are " scaled" . Second they contribute to di/dt coupled and reflected noise. Third higher clock frequencies are making the interconnection medium a more effective radiator especially in the 30 MHz to 1 GHz range where limits have been established by regulatory agencies such as the FCC. Approaches to understanding these phenomena will be highlighted.

Citation Download Citation

Dennis J. McBride "CAD in new areas of the package and interconnect design space", Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); https://doi.org/10.1117/12.25587

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