Laser-induced gold deposition for thin-film circuit repair

Thomas H. Baum; Paul B. Comita; Toivo T. Kodas

doi:10.1117/12.51033

1 December 1991 Laser-induced gold deposition for thin-film circuit repair

Thomas H. Baum, Paul B. Comita, Toivo T. Kodas

Proceedings Volume 1598, Lasers in Microelectronic Manufacturing; (1991) https://doi.org/10.1117/12.51033
Event: Microelectronic Processing Integration, 1991, San Jose, CA, United States

Abstract

Laser chemical vapor deposition (LCVD) of gold has been used to repair 'open' defect on high-end multi-chip packaging modules. The ability to repair metallurgical features of less than 25 micrometers width was readily accomplished and electrical resistances are comparable to resistances of unrepaired nets of identical geometry. The reliability of LCVD repairs was monitored after thermal processing, T&H and electrical stressing. The ability to repair 'open' defects in the thin-film redistribution (TFR) layer of the module has facilitated testing of designs early in the development process.

Citation Download Citation

Thomas H. Baum, Paul B. Comita, and Toivo T. Kodas "Laser-induced gold deposition for thin-film circuit repair", Proc. SPIE 1598, Lasers in Microelectronic Manufacturing, (1 December 1991); https://doi.org/10.1117/12.51033

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