PROCEEDINGS VOLUME 3510
MICROELECTRONIC MANUFACTURING | 20-24 SEPTEMBER 1998
Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV
Editor(s): Sharad Prasad, Hans-Dieter Hartmann, Tohru Tsujide
Editor Affiliations +
IN THIS VOLUME

6 Sessions, 28 Papers, 0 Presentations, 0 Posters
Simulation  (3)
MICROELECTRONIC MANUFACTURING
20-24 September 1998
Santa Clara, CA, United States
Advanced Failure Analysis I
Romain Desplats, Bertrand Fougnie, Philippe Perdu, Jamel Benbrik, Francois Marc, Yves Danto
Proceedings Volume Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (1998) https://doi.org/10.1117/12.324368
Masaru Sanada, Hiromu Fujioka
Proceedings Volume Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (1998) https://doi.org/10.1117/12.324376
Romain Desplats, Jamel Benbrik, Bruno Benteo, Philippe Perdu
Proceedings Volume Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (1998) https://doi.org/10.1117/12.324391
Sven-Olaf Schellenberg, Uwe Herdickerhoff
Proceedings Volume Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (1998) https://doi.org/10.1117/12.324392
Simulation
Dirk Uffmann
Proceedings Volume Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (1998) https://doi.org/10.1117/12.324393
Mark P.C. Chia, Gerard A. Allan, Anthony J. Walton
Proceedings Volume Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (1998) https://doi.org/10.1117/12.324394
Li Chen, Linda Milor, Charles Ouyang, Wojciech P. Maly, Yeng-Kaung Peng
Proceedings Volume Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (1998) https://doi.org/10.1117/12.324395
Packaging-Related Reliability Issues
Yield, Modeling, Statistics
Ehren Achee, Greg Petter, James Reedholm
Proceedings Volume Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (1998) https://doi.org/10.1117/12.324371
Miguel Alonso Merino, Miguel Recio, Julian Moreno, Victorino Martin Santamaria, Almudena Fernandez, Gerardo Gonzalez, Enrique Borrego, Luis J. Barrios, Maria D. del Castillo, et al.
Proceedings Volume Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (1998) https://doi.org/10.1117/12.324372
Proceedings Volume Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (1998) https://doi.org/10.1117/12.324373
Advanced Failure Analysis II
Yasuhiro Kimura, Hideki Naruoka, Morihiko Kume, Toshiharu Katayama, Hidekazu Yamamoto, Yoji Mashiko
Proceedings Volume Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (1998) https://doi.org/10.1117/12.324374
Neil Bryan Henis, Scott Bolton, Ruben Montez, James Legg, Sung Kim, Quong Vuong
Proceedings Volume Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (1998) https://doi.org/10.1117/12.324375
Antonio Cacciato, S. Evseev, S. Vleeshouwers, I. Rink
Proceedings Volume Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (1998) https://doi.org/10.1117/12.324377
Daren L. Dance, Christopher W. Long
Proceedings Volume Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (1998) https://doi.org/10.1117/12.324382
Poster Session
Heinz Reiter, Othmar Leitner
Proceedings Volume Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (1998) https://doi.org/10.1117/12.324383
Ingrid Jonak-Auer, Friedemar Kuchar
Proceedings Volume Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (1998) https://doi.org/10.1117/12.324384
Xun Qing Shi, Wei Zhou, Hock Lye John Pang, Zhenfeng P. Wang
Proceedings Volume Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (1998) https://doi.org/10.1117/12.324385
Jang Ming Chiou, Sheng Liang Pan, Kai Ming Ching, Bi-Jiang Chang, Kuo-Liang Lu
Proceedings Volume Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (1998) https://doi.org/10.1117/12.324386
Vijay Janapaty, Jiunn-Yann Tsai, Sharad Prasad
Proceedings Volume Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (1998) https://doi.org/10.1117/12.324387
Packaging-Related Reliability Issues
Poster Session
M. Oner, Bharat L. Bhuva, P. Sisterhen, H. Hasan, Sherra E. Kerns
Proceedings Volume Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (1998) https://doi.org/10.1117/12.324389
Ting Cheong Ang, Man Siu Tse, Lap Hung Chan, John L. Sudijono
Proceedings Volume Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (1998) https://doi.org/10.1117/12.324390
Advanced Failure Analysis I
Proceedings Volume Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (1998) https://doi.org/10.1117/12.324378
Daniel C. Edelstein
Proceedings Volume Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (1998) https://doi.org/10.1117/12.324379
Jack Y. C. Sun
Proceedings Volume Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (1998) https://doi.org/10.1117/12.324380
Alain S. Harrus, John Kelly, Ronald A. Powell
Proceedings Volume Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (1998) https://doi.org/10.1117/12.324381
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