Paper
26 July 1999 8x8 arrays of VCSEL/CMOS and photodetectors: optoelectronic interconnects
Author Affiliations +
Abstract
We demonstrate an optoelectronic interconnect based on an 8 by 8 array of vertical-cavity surface-emitting lasers, an 8 by 8 array of photodetectors, and a single compound lens. The substrate-emitting VCSEL array and back-illuminated photodetector array were flip-chip bonded to a CMOS driver circuit and a Si fan-out pad array, respectively. The CMOS driver provides laser addressing, signal conditioning and modulation current.In this paper we will describe the interconnect configuration, device structures and characteristics, and CMOS driver circuits. We then discuss the system operation and performance.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
John T. Pham, George J. Simonis, Jagadeesh Pamulapati, William B. Lawler, Paul H. Shen, J. Jiang Liu, Wayne H. Chang, Peter G. Newman, Monica Alba Taysing-Lara, Bikash Koley, and Mario Dagenais "8x8 arrays of VCSEL/CMOS and photodetectors: optoelectronic interconnects", Proc. SPIE 3714, Enabling Photonic Technologies for Aerospace Applications, (26 July 1999); https://doi.org/10.1117/12.354688
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CITATIONS
Cited by 2 scholarly publications.
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KEYWORDS
Vertical cavity surface emitting lasers

Sensors

Photodetectors

Signal detection

Optical interconnects

Optoelectronics

Modulation

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