Paper
25 August 1999 EB_PEC by using OPC software
Kenny Yang
Author Affiliations +
Abstract
Proximity effect is a major source of CD variation in EB process, many solution had been proposed to solve this problem on EB writer, but it is very difficult to handle all kind of pattern and the pattern environment is getting more and more complex. Recent OPC software is widely used by wafer fab and the speed of computer platform is improved to make it less painful to run the OPC software. It is not much theoretical difference between OPC and EB_PEC for this kind of software, so instead of doing PEC on EB writer, the software EB_PEC may be a good approach.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kenny Yang "EB_PEC by using OPC software", Proc. SPIE 3748, Photomask and X-Ray Mask Technology VI, (25 August 1999); https://doi.org/10.1117/12.360197
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KEYWORDS
Optical proximity correction

Critical dimension metrology

Photomasks

Semiconducting wafers

Wet etching

Etching

Photoresist processing

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