Microstructure defect detection using thermal response

Brandon Olson; Kuan H. Chen

doi:10.1117/12.462876

19 April 2002 Microstructure defect detection using thermal response

Brandon Olson, Kuan H. Chen

Proceedings Volume 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002; (2002) https://doi.org/10.1117/12.462876
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, 2002, Cannes-Mandelieu, France

Abstract

Detecting thermal and mechanical defects within multilayered microstructures is an important research area within the microdevice community. The detection of material flaws, mechanical damage, and packaging irregularities is often critical to the overall performanc eof the end product. The technique presented hereafter uses a series of surface temperature measurements, generated by a step function heat flux, to determine the thermal properties of a one- dimensional structure. These properties can either be used directly in a design effort, or they can be used as an indicator of problems that may exist within the structure. This technique is essentially non-invasive and it places no requirements on structure size, thus it is predisposed to semiconductor and MEMS applications. The technique exploits a thermal-electrical analog to match a measured thermal resistance pattern with the pattern of a corresponding thermal structure. Typically, the dimensions of the structure and the disturbance amplitude are required for property value determination.

Citation Download Citation

Brandon Olson and Kuan H. Chen "Microstructure defect detection using thermal response", Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); https://doi.org/10.1117/12.462876

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