Die-attach epoxy reliability of InGaN LEDs

Albert Welsh Jr.; Liwen Fu; William W. So; Huabiao Bill Yuan

doi:10.1117/12.457160

26 November 2002 Die-attach epoxy reliability of InGaN LEDs

Albert Welsh Jr., Liwen Fu, William W. So, Huabiao Bill Yuan

Proceedings Volume 4776, Solid State Lighting II; (2002) https://doi.org/10.1117/12.457160
Event: International Symposium on Optical Science and Technology, 2002, Seattle, WA, United States

Abstract

If InGaN LEDs are going to replace current lighting solutions, they must have several money saving characteristics such as: high efficiency, low cost, and long reliability. We will take a look at the reliability aspect of the LEDs based on a comparison of different types of die-attach epoxies used to package the LED's.

Citation Download Citation

Albert Welsh Jr., Liwen Fu, William W. So, and Huabiao Bill Yuan "Die-attach epoxy reliability of InGaN LEDs", Proc. SPIE 4776, Solid State Lighting II, (26 November 2002); https://doi.org/10.1117/12.457160

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available