Paper
25 April 2008 Characterization of materials and film stacks for accurate surface topography measurement using a white-light optical profiler
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Abstract
Pupil-Plane Scanning White-Light Interferometry measures reflectivity as a function of angle of incidence, wavelength and polarization in one location of an object surface. This information is converted into ellipsometric information and allows the characterization of material optical properties and layer thickness in the case of layered structures. We illustrate the capability of the method by measuring the thickness and refractive index of thin film standards. The information is also used to create accurate 3D topography maps of complex object structures.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
X. Colonna de Lega and Peter J. de Groot "Characterization of materials and film stacks for accurate surface topography measurement using a white-light optical profiler", Proc. SPIE 6995, Optical Micro- and Nanometrology in Microsystems Technology II, 69950P (25 April 2008); https://doi.org/10.1117/12.782836
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CITATIONS
Cited by 14 scholarly publications and 6 patents.
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KEYWORDS
Microscopes

Silicon

Oxides

Optical properties

Polarization

Refractive index

Data modeling

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