Paper
4 December 2008 Practical requirement for reflectivity control in sub 30nm device using high NA immersion lithography
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Proceedings Volume 7140, Lithography Asia 2008; 714032 (2008) https://doi.org/10.1117/12.804671
Event: SPIE Lithography Asia - Taiwan, 2008, Taipei, Taiwan
Abstract
Reflectivity comparison study of bottom anti reflectivity coating (BARC) was investigated at 30nm node devices with same gate width at different pitch sizes. The goal of this study is to elucidate the practical target of reflectivity for high NA immersion lithography especially focusing on the changes in the CD variation. Using double patterning technology (DPT) and single patterning technology (SPT) patterns in high NA systems, we studied the impact of reflectivity to the lithography performance for various ARC thicknesses. A strong dependence of n, k values (of BARC and substrate) on reflectivity was confirmed by simulation. Standing wave effects were investigated by vertical profiles inspection and changes in lithographic performances. Finally, we investigated the critical dimension uniformity (CDU), and line width roughness (LWR) variations for various reflectivities using hard mask substrates. Our experimental and simulation results clearly show that a 0.1% reflectivity target is highly recommendable for the sub-30 nm device process using high NA immersion lithography.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yun-kyeong Jang, So-ra Han, Hyoung-hee kim, Jin-Young Yoon, Shi-yong Lee, Kwang-sub Yoon, Seok-hwan Oh, Seong-Woon Choi, and Woo-Sung Han "Practical requirement for reflectivity control in sub 30nm device using high NA immersion lithography", Proc. SPIE 7140, Lithography Asia 2008, 714032 (4 December 2008); https://doi.org/10.1117/12.804671
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KEYWORDS
Reflectivity

Lithography

Critical dimension metrology

Line width roughness

Immersion lithography

Optical lithography

Photomasks

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