Material considerations for vertical integration of IRFPAs (Conference Presentation)

Sushant Sonde; Kiran Sasikumar; Yong Chang; Subramanian KRS Sankaranarayanan; Silviu Velicu

doi:10.1117/12.2633654

11 October 2022 Material considerations for vertical integration of IRFPAs (Conference Presentation)

Sushant Sonde, Kiran Sasikumar, Yong Chang, Subramanian KRS Sankaranarayanan, Silviu Velicu

Proceedings Volume PC12234, Infrared Sensors, Devices, and Applications XII; PC122340A (2022) https://doi.org/10.1117/12.2633654
Event: SPIE Optical Engineering + Applications, 2022, San Diego, California, United States

Abstract

Novel integration method that addresses thermo-mechanical reliability of the IRFPA hybrid assembly in advanced three-dimensional integration scheme requires optimization by engineering materials used for vertical integration and geometry engineering of the assemblies to be integrated. We present such optimization scheme and applicability of this method to vertical integration of HgCdTe and Type-II Superlattice (T2SL) based IRFPA.

Conference Presentation

Citation Download Citation

Sushant Sonde, Kiran Sasikumar, Yong Chang, Subramanian KRS Sankaranarayanan, and Silviu Velicu "Material considerations for vertical integration of IRFPAs (Conference Presentation)", Proc. SPIE PC12234, Infrared Sensors, Devices, and Applications XII, PC122340A (11 October 2022); https://doi.org/10.1117/12.2633654

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