Dr. Kiran Sasikumar Profile

Dr. Kiran Sasikumar

at Argonne National Lab

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Publications (3)

Proceedings Article | 3 October 2024 Paper

Thermomechanical modeling and optimization of infrared focal plane arrays: the impact of packaging assemblies

Vineet Kumar, Kiran Sasikumar, Yong Chang, Subramanian KRS Sankaranarayanan, Silviu Velicu, Sushant Sonde

Proceedings Volume 13145, 1314508 (2024) https://doi.org/10.1117/12.3028277

KEYWORDS: Readout integrated circuits, Silicon, Packaging, Metals, Mercury cadmium telluride, Indium, Dielectrics, Design, Sensors, Materials properties

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The established technological standards, architectures, and material choices in the realm of advanced infrared (IR) imaging has enabled the design of high-resolution and high-range IR focal plane arrays (IRFPAs) while minimizing the cost, size, weight, and power consumption of the device. HgCdTe (MCT) has also emerged as the standard choice for the IRFPA device's detector layer as semiconductor material due to its high performance-to-cost, ability to operate optimally at extreme temperatures, and access to new application domains like two-color, active, and passive shortwave infrared (SWIR) imaging. Recent work has focused on a thermomechanical-stress-aware approach for advanced integration of IRFPAs leading to the design of Modified Direct Bond Interconnect (MoDiBI) integration technology which offers the possibility to venture toward design and fabrication of small pixel pitch, large format IRFPAs with longer term operational reliability. In the thermomechanical stress aware approach, finite element modeling is used to predict the effects of cyclic thermal load on the device's components. The device's geometry and materials are optimized based on the prediction.

Hitherto, however, such thermomechanical-stress-aware design has been focused on the detector-readout assemblies. The effect of the IRFPA packaging on the overall IRFPA performance under thermal load remains underexplored. Typically, the packaging involves a Balanced Composite Structure (BCS) sandwiched between the detector chip and the base plate for improving the thermomechanical reliability. In this work, we discuss the impact material choices in BCS has on the induced thermal stresses in critical components of the detector-readout assembly. We show that for an existing intricate and non-linear interplay between the detector chip, Si ROIC, and the BCS components, it may be beneficial to tune the thickness of the Si ROIC and to consider multi-parameter geometry and material optimization for designing IRFPA and packaging assemblies with optimal thermal performance. Further, we also suggest the novel material properties within the BCS stack that yield optimal thermomechanical response in the detector chip for chosen device configurations.

Proceedings Article | 10 October 2023 Presentation

Optimizing advanced integration technology for large format, small pixel IRFPAs

Sushant Sonde, Kiran Sasikumar, Yong Chang, Subramanian Sankaranarayanan, Silviu Velicu

Proceedings Volume PC12687, PC1268708 (2023) https://doi.org/10.1117/12.2677419

KEYWORDS: Reliability, Mercury cadmium telluride

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Proceedings Article | 11 October 2022 Presentation

Material considerations for vertical integration of IRFPAs (Conference Presentation)

Sushant Sonde, Kiran Sasikumar, Yong Chang, Subramanian KRS Sankaranarayanan, Silviu Velicu

Proceedings Volume PC12234, PC122340A (2022) https://doi.org/10.1117/12.2633654

KEYWORDS: Staring arrays, Indium, Thermography, Thermal modeling, Superlattices, Sensors, Reliability, Mercury cadmium telluride, Infrared radiation, Finite element methods

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