Semiconductor processing technology is the foundation of the development of semiconductor industry, and the manufacturing level will affect the key parameters of semiconductor products. Therefore, it is necessary to develop metrology technique that matches the current semiconductor processing accuracy. White light dispersive interferometry (WLDI) technology, as a highresolution optical metrological technique for measuring complicated surfaces, has been applied in the technical research in the semiconductor inspection. In this paper, the set-up of Linnik type line-scan WLDI system is developed, and the data processing algorithm is proposed to realize the simultaneous measurement of the surface profile and film thickness with high measurement efficiency. The experimental results indicate the current system has a good measurement performance.
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