Dr. Gilles R. Amblard
Principal /Engineering Manager at Samsung Austin Semiconductors LLC
SPIE Involvement:
Conference Co-Chair | Editor | Author
Area of Expertise:
Photolithography , Advanced patterning , Materials , Semiconductor , Immersion , EUV
Profile Summary

Dr. Gilles Amblard has an extensive career in semiconductor lithography, from e-beam to g-line to i-line to KrF to ArF dry and immersion to EUV lithography. He has held positions of leadership in photolithography research, development, and operations in research organizations such as CNET and SEMATECH, as well as many of the leading companies in the semiconductor industry, including Intel, Samsung, AMD, IBM and STMicroelectronics. Over the course of his career, Dr. Amblard has pioneered lithography technologies, developing advanced processes and implementing them into high volume manufacturing for production of multiple technology nodes from half-micron down to sub-10nm. Prior to starting his career, he earned advanced degrees and a PhD in materials chemistry. During the course of his career, he researched and produced multiple US patents and was the author of several publications in SPIE proceedings and other technical journals and publications. Dr. Amblard has also been serving as Program Committee Member and Session Chairman for SPIE Advanced Lithography /Advances in Materials and Processes Conferences.
Publications (15)

Proceedings Article | 25 March 2016 Paper
Gilles Amblard, Sara Purdy, Ryan Cooper, Marjory Hockaday
Proceedings Volume 9779, 97790U (2016) https://doi.org/10.1117/12.2219375
KEYWORDS: Lithography, Photoresist materials, High volume manufacturing, Line edge roughness, Yield improvement, Immersion lithography, Photomasks, Manufacturing, Control systems, Metrology, Line width roughness, Optical lithography, Semiconducting wafers, Cadmium sulfide, Photoresist developing, Inspection

Proceedings Article | 4 April 2011 Paper
Proceedings Volume 7970, 797017 (2011) https://doi.org/10.1117/12.879142
KEYWORDS: Semiconducting wafers, Thin film coatings, Carbon nanotubes, Oxides, Silicon, Coating, Absorbance, Manufacturing, Silicon films, Silicon carbide

Proceedings Article | 12 June 2003 Paper
Richard Peters, Gilles Amblard, Jen-Jiang Lee, Todd Guenther
Proceedings Volume 5039, (2003) https://doi.org/10.1117/12.485132
KEYWORDS: Line edge roughness, Lithography, Photoresist processing, Photoresist materials, Scanning electron microscopy, Semiconducting wafers, Silicon, Fluorine, Ions, Mass spectrometry

Proceedings Article | 24 July 2002 Paper
Proceedings Volume 4690, (2002) https://doi.org/10.1117/12.474227
KEYWORDS: Line edge roughness, Photoresist processing, 193nm lithography, Lithography, Semiconducting wafers, Fluorine, Scanning electron microscopy, Molecules, Scanners, Matrices

Proceedings Article | 23 June 2000 Paper
Gilles Amblard, Jeff Byers, Wolf-Dieter Domke, Georgia Rich, Victoria Graffenberg, Shashikant Patel, Daniel Miller, Gabriel Perez
Proceedings Volume 3999, (2000) https://doi.org/10.1117/12.388323
KEYWORDS: Monochromatic aberrations, Chlorine, Etching, Photoresist materials, Lithography, Silicon, Polymers, Critical dimension metrology, Semiconducting wafers, Aluminum

Showing 5 of 15 publications
Proceedings Volume Editor (2)

SPIE Conference Volume | 24 April 2024

SPIE Conference Volume | 22 May 2023

Conference Committee Involvement (8)
Advances in Patterning Materials and Processes XLI
26 February 2024 | San Jose, California, United States
Advances in Patterning Materials and Processes XL
27 February 2023 | San Jose, California, United States
Advances in Patterning Materials and Processes XXXIX
25 April 2022 | San Jose, California, United States
Advances in Patterning Materials and Processes XXXVIII
22 February 2021 | Online Only, California, United States
Advances in Patterning Materials and Processes XXXVII
24 February 2020 | San Jose, California, United States
Showing 5 of 8 Conference Committees
SIGN IN TO:
  • View contact details

UPDATE YOUR PROFILE
Is this your profile? Update it now.
Don’t have a profile and want one?

Advertisement
Advertisement
Back to Top