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Huang Peng
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Publications (1)
Proceedings Article | 7 August 2023 Paper
Using ANSYS analyse to predict laser of flip chip packaging
Huang Peng, Yichia Lin, Zuoqian Yu
Proceedings Volume 12781, 127811I (2023) https://doi.org/10.1117/12.2686798
KEYWORDS: Laser welding, Laser processing, Deformation, Laser soldering, Finite element methods, Thermal deformation, Packaging, Materials properties, Optical simulations, Metals
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