Dr. Joachim Janes Profile

Dr. Joachim Janes

at Fraunhofer-ISIT

SPIE Involvement:

Author

Publications (18)

Proceedings Article | 22 May 2015 Paper

2D MEMS scanning LIDAR with sub-Nyquist sampling, set-up and functionality

Joachim Janes, Thorsten Giese

Proceedings Volume 9495, 94950S (2015) https://doi.org/10.1117/12.2175855

KEYWORDS: LIDAR, Scanners, Microelectromechanical systems, Avalanche photodetectors, Laser scanners, 3D scanning, Mirrors, Sensors, Analog electronics, Solids

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Proceedings Article | 22 May 2015 Paper

2D MEMS scanning for LIDAR with sub-Nyquist sampling, electronics, and measurement procedure

Thorsten Giese, Joachim Janes

Proceedings Volume 9495, 94950F (2015) https://doi.org/10.1117/12.2175851

KEYWORDS: LIDAR, Electronics, Microelectromechanical systems, Scanners, Modulation, Laser scanners, 3D scanning, Signal detection, Analog electronics, Solids

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Proceedings Article | 27 February 2015 Paper

Centimeter-scale MEMS scanning mirrors for high power laser application

F. Senger, U. Hofmann, Thomas von Wantoch, C. Mallas, J. Janes, W. Benecke, Patrick Herwig, P. Gawlitza, Moises Ortega Delgado, C. Grune, J. Hannweber, A. Wetzig

Proceedings Volume 9375, 937509 (2015) https://doi.org/10.1117/12.2079600

KEYWORDS: Mirrors, Microelectromechanical systems, Semiconducting wafers, High power lasers, Laser applications, Scanners, Modulation, Electrodes, Laser scanners, 3D scanning

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Proceedings Article | 27 February 2015 Paper

Piezoelectrically driven translatory optical MEMS actuator with 7mm apertures and large displacements

H.- Quenzer, S. Gu-Stoppel, F. Stoppel, J. Janes, U. Hofmann, W. Benecke

Proceedings Volume 9375, 93750O (2015) https://doi.org/10.1117/12.2077101

KEYWORDS: Mirrors, Actuators, Spectrometers, FT-IR spectroscopy, Ferroelectric materials, Doppler effect, Semiconducting wafers, Microopto electromechanical systems, Silicon, Microelectromechanical systems

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Proceedings Article | 27 February 2015 Paper

A study of integrated position sensors for PZT resonant micromirrors

S. Gu-Stoppel, H. Quenzer, Felix Heinrich, J. Janes, W. Benecke

Proceedings Volume 9375, 93750B (2015) https://doi.org/10.1117/12.2076764

KEYWORDS: Sensors, Ferroelectric materials, Micromirrors, Actuators, Platinum, Position sensors, Mirrors, Wheatstone bridges, Signal to noise ratio, Electronics

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Proceedings Article | 7 March 2014 Paper

Analysis of capacitive sensing for 2D-MEMS scanner laser projection

Thomas von Wantoch, Christian Mallas, Ulrich Hofmann, Joachim Janes, Bernhard Wagner, Wolfgang Benecke

Proceedings Volume 8977, 897707 (2014) https://doi.org/10.1117/12.2038606

KEYWORDS: Capacitance, Micromirrors, Sensors, Mathematical modeling, Electrodes, Laser scanners, 3D scanning, Microelectromechanical systems, Analog electronics, Scanners

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Proceedings Article | 7 March 2014 Paper

Studies on the dynamics of vacuum encapsulated 2D MEMS scanners by laser Doppler vibrometry

Joachim Janes, Ulrich Hofmann

Proceedings Volume 8975, 89750H (2014) https://doi.org/10.1117/12.2037182

KEYWORDS: Microelectromechanical systems, Mirrors, Scanners, Laser scanners, 3D scanning, Doppler effect, Vibrometry, Glasses, Semiconducting wafers, Micromirrors

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Proceedings Article | 7 March 2014 Paper

Two-dimensional scanning using two single-axis low-voltage PZT resonant micromirrors

S. Gu-Stoppel, J. Janes, H. Quenzer, U. Hofmann, W. Benecke

Proceedings Volume 8977, 897706 (2014) https://doi.org/10.1117/12.2036565

KEYWORDS: Micromirrors, Mirrors, Ferroelectric materials, Actuators, Silicon, Electromagnetism, Polarization, Finite element methods, Laser sources, Laser based displays

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Proceedings Article | 7 March 2014 Paper

Wafer-level vacuum-packaged two-axis MEMS scanning mirror for pico-projector application

Ulrich Hofmann, Frank Senger, Joachim Janes, Christian Mallas, Vanessa Stenchly, Thomas von Wantoch, Hans-Joachim Quenzer, Manfred Weiss

Proceedings Volume 8977, 89770A (2014) https://doi.org/10.1117/12.2038249

KEYWORDS: Mirrors, Microelectromechanical systems, Packaging, Glasses, Semiconducting wafers, Laser based displays, Electrodes, Modulation, High power lasers, Oscillators

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SPIE Journal Paper | 2 December 2013

Resonant biaxial 7-mm MEMS mirror for omnidirectional scanning

Ulrich Hofmann, Mika Aikio, Joachim Janes, Frank Senger, Vanessa Stenchly, Juergen Hagge, Hans-Joachim Quenzer, Manfred Weiss, Thomas von Wantoch, Christian Mallas, Bernhard Wagner, Wolfgang Benecke

JM3, Vol. 13, Issue 01, 011103, (December 2013) https://doi.org/10.1117/12.10.1117/1.JMM.13.1.011103

KEYWORDS: Mirrors, Microelectromechanical systems, Laser scanners, Roads, Sensors, Laser development, Packaging, Wafer bonding, Actuators

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Proceedings Article | 13 March 2013 Paper

Resonant biaxial 7-mm MEMS mirror for omnidirectional scanning

U. Hofmann, M. Aikio, J. Janes, F. Senger, V. Stenchly, M. Weiss, H.-J. Quenzer, B. Wagner, W. Benecke

Proceedings Volume 8616, 86160C (2013) https://doi.org/10.1117/12.2006189

KEYWORDS: Mirrors, Microelectromechanical systems, Semiconducting wafers, Sensors, Glasses, Silicon, Packaging, Wafer bonding, Wafer-level optics, Neodymium

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Proceedings Article | 9 March 2013 Paper

Piezoelectric resonant micromirror with high frequency and large deflection applying mechanical leverage amplification

S. Gu-Stoppel, J. Janes, D. Kaden, H. Quenzer, U. Hofmann, W. Benecke

Proceedings Volume 8612, 86120I (2013) https://doi.org/10.1117/12.2001620

KEYWORDS: Micromirrors, Actuators, Ferroelectric materials, Mirrors, Finite element methods, Electromagnetism, Silicon, Thin films, Silica, Microelectromechanical systems

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Proceedings Article | 5 March 2013 Paper

New fabrication method of glass packages with inclined optical windows for micromirrors on wafer level

Vanessa Stenchly, Hans-Joachim Quenzer, Ulrich Hofmann, Joachim Janes, Björn Jensen, Wolfgang Benecke

Proceedings Volume 8613, 861319 (2013) https://doi.org/10.1117/12.2001760

KEYWORDS: Glasses, Semiconducting wafers, Silicon, Mirrors, Micromirrors, Wafer-level optics, Wafer bonding, Packaging, Surface roughness

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For many applications it is inevitable to protect MEMS devices against environmental impacts like humidity which can affect their performance. Moreover recent publications demonstrates that micro mirrors can achieve very large optical scan angles at moderate driving voltages even exceeding 100 degrees when hermetically sealed under vacuum. While discrete chips may be evacuated and sealed on single die level using small can packages like TO housings, it is obvious that for high volume production a much more economical solution for the realisation of transparent optical packages already on wafer level must be developed. However, since any laser beam crossing a transparent glass surface is partly reflected even when anti-reflective coatings are applied, the construction of a wafer level optical housing suitable for laser projection purpose requires more than the integration of simple plane glass cap. The use of inclined optical windows avoids the occurrence of intense reflections of the incident laser beam in the projected images. This paper describes a unique technology to fabricate glass packages with inclined optical windows for micro mirrors on 8 inch wafers. The new process uses a high temperature glass forming process based on subsequent wafer bonding. A borosilicate glass wafer is bonded together with two structured silicon wafers. By grinding both sides of the wafer stack, a pattern of isolated silicon structures is defined. This preprocessed glass wafer is bonded thereon on a third structured silicon wafer, wherein the silicon islands are inserted into the cavities. By setting a defined pressure level inside the cavities during the final wafer bonding, the silicon glass stack extruded and it is out of plane during a subsequent annealing process at temperatures above the softening point of the glass. Finally the silicon is selectively removed in a wet etching process. This technique allows the fabrication of 8 inch glass wafers with oblique optical surfaces with surface roughness <1 nm and an evenness of < 300 nm.

Proceedings Article | 14 February 2011 Paper

MEMS scanning laser projection based on high-Q vacuum packaged 2D-resonators

U. Hofmann, C. Eisermann, H.-J. Quenzer, J. Janes, C. Schroeder, O. Schwarzelbach, B. Jensen, L. Ratzmann, T. Giese, F. Senger, J. Hagge, M. Weiss, B. Wagner, W. Benecke

Proceedings Volume 7930, 79300R (2011) https://doi.org/10.1117/12.878676

KEYWORDS: Mirrors, Microelectromechanical systems, Semiconducting wafers, Glasses, Scanners, Silicon, Wafer bonding, Packaging, Electrodes

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Proceedings Article | 26 February 2008 Paper

A novel fabrication technology for anti-reflex wafer-level vacuum packaged microscanning mirrors

M. Oldsen, U. Hofmann, H. J. Quenzer, J. Janes, C. Stolte, K. Gruber, M. Ites, F. Sörensen, B. Wagner

Proceedings Volume 6882, 688208 (2008) https://doi.org/10.1117/12.760941

KEYWORDS: Semiconducting wafers, Mirrors, Wafer bonding, Silicon, Glasses, Scanners, Oxides, Optical resolution, Micromirrors, Gold

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Proceedings Article | 21 February 2008 Paper

Wafer-level vacuum packaged resonant micro-scanning mirrors for compact laser projection displays

Ulrich Hofmann, Marten Oldsen, Hans-Joachim Quenzer, Joachim Janes, Martin Heller, Manfred Weiss, Georgios Fakas, Lars Ratzmann, Eleonora Marchetti, Francesco D'Ascoli, Massimiliano Melani, Luca Bacciarelli, Emilio Volpi, Francesco Battini, Luca Mostardini, Francesco Sechi, Marco De Marinis, Bernd Wagner

Proceedings Volume 6887, 688706 (2008) https://doi.org/10.1117/12.763433

KEYWORDS: Mirrors, Semiconducting wafers, Micromirrors, Silicon, Microelectromechanical systems, Laser based displays, Packaging, Scanners, Raster graphics, Sensors

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