Dr. Kazuya Hirata Profile

Dr. Kazuya Hirata

at DISCO Corp

SPIE Involvement:

Author

Publications (1)

Proceedings Article | 19 February 2018 Paper

New laser slicing technology named KABRA process enables high speed and high efficiency SiC slicing

Kazuya Hirata

Proceedings Volume 10520, 1052003 (2018) https://doi.org/10.1117/12.2291458

KEYWORDS: Semiconducting wafers, Silicon carbide, Laser applications, Wafer manufacturing, Laser processing, Laser development, Silicon, Laser scanners, Manufacturing, Interferometers

Read Abstract +

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Keywords/Phrases

Search In:

Publication Years