The world is rapidly shifting towards data-centric computing model with significant growth in compute, storage and networking. Moore’s law scaling to reduce power, improve performance and reduce area and cost per transistor to support data centric growth places significant challenges for photomask process, control, and metrology. DUV lithography continues to be workhorse technology and continues to drive innovation. Multiple solutions are being developed to solve DUV mask challenges associated with a big die requirement. While DUV production is being projected to be strong for next few years, EUV is picking up pace and being deployed in high volume manufacturing. EUV is an opportunity-rich environment for improvements and innovations that will continue to advance the journey. EUV HiNA is a major step in the lithography paradigm where 0.55 NA EUV optics will enable a shift to sub-10nm resolution. The HiNA mask ecosystem will adapt by growing the newly created low NA EUV supply chain into new directions. The photomask environment will continue to bring creativity, drive innovations and gain commercial rewards.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.