Dr. Marco Moraja
Business Area Manager at SAES Getters SpA
SPIE Involvement:
Author
Publications (6)

Proceedings Article | 31 May 2012 Paper
Proceedings Volume 8353, 83533C (2012) https://doi.org/10.1117/12.920566
KEYWORDS: Microelectromechanical systems, Methane, Gases, Instrument modeling, Microbolometers, Sensors, Carbon monoxide, Thin film devices, Thin films, Metals

SPIE Journal Paper | 1 July 2008
JM3, Vol. 7, Issue 03, 033013, (July 2008) https://doi.org/10.1117/12.10.1117/1.2964288
KEYWORDS: Cesium, Absorption, Silicon, Glasses, Atomic clocks, Semiconducting wafers, Etching, Modulation, Microelectromechanical systems, Chemical species

Proceedings Article | 14 February 2008 Paper
A. Bonucci, S. Guadagnuolo, A. Caterino, A. Conte, M. Moraja
Proceedings Volume 6884, 68840M (2008) https://doi.org/10.1117/12.761140
KEYWORDS: Microelectromechanical systems, Semiconducting wafers, Silicon, Molecules, Wafer bonding, Gases, Reliability, Argon, Testing and analysis, Carbon monoxide

Proceedings Article | 6 January 2006 Paper
A. Conte, M. Moraja, G. Longoni, A. Fourrier
Proceedings Volume 6111, 61110N (2006) https://doi.org/10.1117/12.647710
KEYWORDS: Sensors, Microelectromechanical systems, Semiconducting wafers, Gases, Thin films, Silicon, Packaging, Infrared sensors, Carbon monoxide, Sensor performance

Proceedings Article | 23 December 2003 Paper
Proceedings Volume 5343, (2003) https://doi.org/10.1117/12.525099
KEYWORDS: Semiconducting wafers, Microelectromechanical systems, Silicon, Wafer bonding, Packaging, Glasses, Particles, Industrial chemicals, Carbon monoxide, Silicon films

Showing 5 of 6 publications
Conference Committee Involvement (1)
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI
23 January 2007 | San Jose, California, United States
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