Mr. Michael A. Argument Profile

Michael A. Argument

Graduate Student

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Proceedings Article | 29 August 2017 Paper

Femtosecond micromachining of glass and semiconductor materials

Michael Argument

Proceedings Volume 10313, 1031321 (2017) https://doi.org/10.1117/12.2283869

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Investigations are being carried out to improve the quality of laser micromachining of glass and semiconductor materials and to achieve submicron finished tolerances. Experiments have been carried out mainly with wavelengths ranging from 248 to 800 nm and pulse lengths of 130 to 400 fs. Comparisons are also being made with machining using 10 ns excimer laser pulses. Laser ablation thresholds, incubation coefficients and ablation rates are measured using single and multiple shot irradiation over a range of incident fluences with well controlled gaussian beams. New techniques for debris removal and crack minimization are being investigated. One technique for debris removal uses a sacrificial thin film of sputtered tungsten on top of the substrate before micromachining. After ablation, the tungsten film and deposited debris may be etched away with hydrogen peroxide. This technique has shown promising results in leaving a much cleaner surface. In order to reduce the amount of cracking of the substrate during laser drilling of glass, we have also been investigating the use of preheated substrates. By raising the temperature of glass before drilling, the sample is more ductile and less prone to cracking.

Proceedings Article | 17 February 2003 Paper

Reduction of stress cracking in micromachining of glass by preheating of samples

Michael Argument, Kenneth Chau, Ying Tsui, Robert Fedosejevs

Proceedings Volume 4833, (2003) https://doi.org/10.1117/12.473933

KEYWORDS: Glasses, Laser ablation, Femtosecond phenomena, Micromachining, Laser drilling, Pulsed laser operation, Diffusion, Laser applications, Plasma, Absorption

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Laser micromachining may be used for a variety of applications including drilling holes or creating trenches in dielectric materials. Cracking around the ablated features can be a significant problem for many applications, particularly when micromachining glass. One possible method for crack reduction, investigated here, involves heating of the substrate during ablation. This leads to a more ductile material that is more able to withstand the thermal shock of the ablation process. In order to increase the ductility, the glass targets are heated by physical contact with an electric heating element. The results of micromachining are analyzed using an optical microscope. The amount of cracking is quantified in terms of the number of visible radial cracks. For nanosecond micromachining, a reduction in the number of cracks and an improvement in the quality of the holes are observed as the glass is heated. The relative improvement using heated substrates and nanosecond pulses is also compared to femtosecond ablation of room temperature substrates.

Proceedings Article | 15 December 2000 Paper

Micromachining with femtosecond 250-nm laser pulses

C. Li, Michael Argument, Ying Tsui, Robert Fedosejevs

Proceedings Volume 4087, (2000) https://doi.org/10.1117/12.406367

KEYWORDS: Laser ablation, Micromachining, Femtosecond phenomena, Metals, Ultraviolet radiation, Aluminum, Copper, Objectives, Absorption, Pulsed laser operation

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Laser micromachining is a flexible technique for precision patterning of surfaces in microelectronics, microelectromechanical devices and integrated optical devices. Typical applications include drilling of holes, cutting of conducting lines or shaping of micro component surfaces. The resolution, edge finish and residual damage to the surrounding and underlying structures depend on a variety of parameters including laser energy, intensity, pulse width and wavelength. Femtosecond pulses are of particular interest because the limited time of interaction limits the lateral expansion of the plasma and the inward propagation of the heat front. Thus, very small spot size can be achieved and minimal heating and damage of underlying layers can be obtained. An additional advantage of femtosecond pulses is that multiphoton absorption leads to efficient coupling of energy to many materials independent of the linear reflectivity of the surface. Thus metals and transmitting dielectrics, which are difficult to micromachine, may be machined with such pulses. The coupling is improved further by employing ultraviolet wavelength laser pulses where the linear absorption typically is much higher than for visible and infrared laser pulses. To explore these advantages, we have initiated a study of the interaction of 250nm femtosecond laser pulses with metals. The laser pulses are obtained by generating the third harmonic from a femtosecond Ti:sapphire laser operating at 750nm. The pulses are focused to various intensities in the range of 1010Wcm2 to 1015 Wcm2 using reflective and refractive microscope objectives and ablation thresholds and ablation rates have been determined for a few metals. In addition the ability to control feature size and produce submicron holes and lines have been investigated. The results are presented and compared to results obtained using infrared and visible femtosecond laser pulses.

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