Mr. Chengzhang Wu Profile

Chengzhang Wu

at Shanghai Huali Integrated Circuit Corp

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Publications (2)

Proceedings Article | 22 February 2021 Presentation + Paper

Hybrid overlay control solution with CDSEM and optical metrology

Chengzhang Wu, Dongyu Xu, Hua Yuan, Yinsheng Yu, Hongwen Zhao, Wenzhan Zhou, Haifeng Pu, Faquan Liu, Jason Pei, Jinyan Song, Kevin Huang

Proceedings Volume 11611, 116111G (2021) https://doi.org/10.1117/12.2583804

KEYWORDS: Overlay metrology, Optical metrology, Process control, Optical parametric oscillators, Metrology, Semiconductors, Scanning electron microscopy, Optics manufacturing, Optical testing, Optical lithography

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With continued innovation of semiconductor processes, overlay control has become the most critical and challenging part. Advanced technology nodes require even tighter lithography overlay control, and therefore, high-order process corrections for inter-field (HOPC) and for intra-field (iHOPC) are adopted as a common solution to meet on-product overlay (OPO) specifications. High order corrections often require more measurement shots and more targets in field, which makes optical overlay metrology on scribe line targets the workhorse of overlay control due to its high throughput and low cost-of-ownership. This leads to the additional challenge that the measurement location also affects the accuracy of generated overlay corrections. For example, it is well known that there may be a spatially dependent offset between overlay on targets and the device. This is commonly called a non-zero offset (NZO) [1], which is a comparison between device overlay measured with the CD SEM after etching (AEI) and optical overlay measured on targets after litho (ADI). In addition, the position of targets could impact the validity of corrections modeled using these targets. The targets could be unevenly distributed in field, some targets huddle at an area, while not a single target appears at others. Hence, this kind of target layout has risks generating problematic field corrections at areas without enough targets. In this paper, we propose a hybrid method utilizing CDSEM overlay to fill in the position where optical overlay targets are deficient. With iHOPC model terms generated by optical overlay targets only, CDSEM metrology results from real devices reveal significantly larger overlay in areas with no targets. By means of this method, the mis-correction at locations where optical overlay targets are deficient is significantly restored, and consequently the OPO mean+3sigma is suppressed to <4nm. Furthermore, an inline control solution is proposed and implemented with the latest generation 5D Analyzer.

Proceedings Article | 20 March 2020 Paper

The improvement of measurement accuracy of SADP pitch walking issue

Pei Liu, Cheng-Zhang Wu, Hung-Wen Chao, Wenzhan Zhou, Yu Zhang, Chan-Yuan Hu, Yujie Xu, Jhen-Cyuan Li, Yen-Chan Chiu, Chun-Han Liu, Ran-Fu Yang, Chi-Hung Wang

Proceedings Volume 11325, 113252Z (2020) https://doi.org/10.1117/12.2552057

KEYWORDS: Transmission electron microscopy, Calibration, Semiconducting wafers, Electron microscopes, Fin field effect transistors, Image filtering, Scanning electron microscopy, Etching, Image quality, Integrated circuits, Deep ultraviolet, 193nm lithography, Electro optical systems calibration, Precision measurement, Accuracy assessment

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