Dr. Xiaoning Li Profile

Dr. Xiaoning Li

Product Engineer at Focuslight Technologies Inc

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Author

Publications (11)

Proceedings Article | 20 February 2018 Paper

High power multiple wavelength diode laser stack for DPSSL application without temperature control

Dong Hou, Xia Yin, Jingwei Wang, Shi Chen, Yun Zhan, Xiaoning Li, Yingmin Fan, Xingsheng Liu

Proceedings Volume 10513, 1051311 (2018) https://doi.org/10.1117/12.2291169

KEYWORDS: Semiconductor lasers, Absorption, Solid state lasers, Temperature metrology, Nd:YAG lasers, Crystals, Resistance, High power lasers, Laser development, Heatsinks

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Proceedings Article | 20 February 2017 Paper

High power vertical stacked diode laser development using macro-channel water cooling and hard solder bonding technology

Dongshan Yu, Xuejie Liang, Jingwei Wang, Xiaoning Li, Zhiqiang Nie, Xingsheng Liu

Proceedings Volume 10123, 101231A (2017) https://doi.org/10.1117/12.2250692

KEYWORDS: Semiconductor lasers, Laser applications, Reliability, Packaging, Laser development, Indium, High power lasers, Laser bonding, Corrosion, Copper, Pulsed laser operation, High power diode lasers, Gold, Thermal efficiency

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Proceedings Article | 22 April 2016 Paper

Packaging of hard solder 500W QCW diode laser array

Xiaoning Li, Jingwei Wang, Dong Hou, Zhiqiang Nie, Xingsheng Liu

Proceedings Volume 9730, 97300D (2016) https://doi.org/10.1117/12.2213977

KEYWORDS: Semiconductor lasers, Packaging, High power lasers, Reliability, Copper, Laser bonding, Near field, High power diode lasers, Laser systems engineering

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Proceedings Article | 22 April 2016 Paper

High power diode laser array development using completely indium free packaging technology with narrow spectrum

Dong Hou, Jingwei Wang, Lijun Gao, Xuejie Liang, Xiaoning Li, Xingsheng Liu

Proceedings Volume 9730, 973009 (2016) https://doi.org/10.1117/12.2213928

KEYWORDS: Semiconductor lasers, High power diode lasers, Laser development, Indium, Resistance, Reliability, High power lasers, Numerical simulations, Gold

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Proceedings Article | 20 February 2015 Paper

Advances in bonding technology for high power diode laser bars

Jingwei Wang, Xiaoning Li, Dong Hou, Feifei Feng, Yalong Liu, Xingsheng Liu

Proceedings Volume 9346, 934605 (2015) https://doi.org/10.1117/12.2079619

KEYWORDS: Semiconductor lasers, High power diode lasers, Indium, Liquids, Heatsinks, Reliability, Packaging, Laser bonding, Laser welding, Laser applications

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Proceedings Article | 20 February 2015 Paper

Effect of interface layer on the performance of high power diode laser arrays

Pu Zhang, Jingwei Wang, Lingling Xiong, Xiaoning Li, Dong Hou, Xingsheng Liu

Proceedings Volume 9346, 934607 (2015) https://doi.org/10.1117/12.2077029

KEYWORDS: High power diode lasers, Semiconductor lasers, Interfaces, Finite element methods, Packaging, Laser development, Numerical simulations, Thermal effects, Copper, Reliability

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Proceedings Article | 20 February 2015 Paper

Effects of packaging on the performances of high brightness 9xx nm CW mini-bar diode lasers

Xiaoning Li, Jingwei Wang, Feifei Feng, Yalong Liu, Dongshan Yu, Pu Zhang, Xingsheng Liu

Proceedings Volume 9346, 93460C (2015) https://doi.org/10.1117/12.2080480

KEYWORDS: Semiconductor lasers, Indium, Packaging, Continuous wave operation, Polarization, Reliability, High power diode lasers, Heatsinks, Fiber lasers, Copper

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Proceedings Article | 3 February 2015 Paper

Packaging of complete indium-free high reliable and high power diode laser array

Jingwei Wang, Xiaoning Li, Feifei Feng, Yalong Liu, Dong Hou, Xingsheng Liu

Proceedings Volume 9255, 92550X (2015) https://doi.org/10.1117/12.2072357

KEYWORDS: Semiconductor lasers, High power diode lasers, Packaging, Indium, Copper, Heatsinks, Reliability, Laser bonding, Optical simulations, Laser development

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Proceedings Article | 9 February 2012 Paper

Hard solder 20-kW QCW stack array diode laser

Xiaoning Li, Lijun Kang, Jingwei Wang, Pu Zhang, Lingling Xiong, Xingsheng Liu

Proceedings Volume 8241, 82410C (2012) https://doi.org/10.1117/12.909772

KEYWORDS: Semiconductor lasers, High power lasers, Beam controllers, Reliability, Packaging, Beam shaping, Collimation, Copper, Thermal effects, Laser welding

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Proceedings Article | 9 February 2012 Paper

3000W CW diode laser cladding system

Lingling Xiong, Min Wang, Xiaobiao Wang, Yanfang Zheng, Di Wu, Pu Zhang, Xiaoning Li, Zhenfu Wang, Xingsheng Liu

Proceedings Volume 8241, 824106 (2012) https://doi.org/10.1117/12.909599

KEYWORDS: Cladding, Semiconductor lasers, Laser systems engineering, Collimation, Laser processing, Nickel, Continuous wave operation, Polarization, Packaging, Lasers

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Proceedings Article | 9 February 2012 Paper

High-power semiconductor laser array packaged on microchannel cooler using gold-tin soldering technology

Jingwei Wang, Lijun Kang, Pu Zhang, Zhiqiang Nie, Xiaoning Li, Lingling Xiong, Xingsheng Liu

Proceedings Volume 8241, 82410H (2012) https://doi.org/10.1117/12.909655

KEYWORDS: Semiconductor lasers, High power lasers, Laser welding, Packaging, Indium, Laser applications, Resistance, High power diode lasers, Continuous wave operation, Reliability

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Showing 5 of 11 publications

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