Wafer topography structures in the implant lithography process, which include the shallow trench isolation and the poly
gate, can result into a severe degradation of the resist profile and significant critical dimension variation. While bottom
anti-reflective coating (BARC) is not suitable for the implant lithography because of the plasma induced substrate
damage, developable bottom anti-reflective coating (DBARC) is now the most promising solution to eliminate wafer
topography effects for the implant layer lithography. Currently, some challenges still remain to be solved and DBARC is
not ready for mass production yet. In this study, a novel method is proposed to improve wafer topography effects by use
of sub-resolution features. Compared with DBARC, this new approach is much more cost effective. Numerical study by
use of Sentaurus-Litho simulation tool shows that the new method is promising and deserves more comprehensive
investigation.
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