EUV mask readiness for HVM (Conference Presentation)

Heebom Kim; Chang Young Jeong; Donggun Lee; Ji Hoon Na; Hwan-Seok Seo; Mun Ja Kim; Sung-Won Kwon; Chan-Uk Jeon

doi:10.1117/12.2280687

16 October 2017 EUV mask readiness for HVM (Conference Presentation)

Heebom Kim, Chang Young Jeong, Donggun Lee, Ji Hoon Na, Hwan-Seok Seo, Mun Ja Kim, Sung-Won Kwon, Chan-Uk Jeon

Proceedings Volume 10451, Photomask Technology 2017; 104510I (2017) https://doi.org/10.1117/12.2280687
Event: SPIE Photomask Technology and EUV Lithography, 2017, Monterey, California, United States

Abstract

Currently, we are supplying defect-free EUV mask for device development. This was one of the biggest challenges in the implementation of EUV lithography for high volume manufacturing (HVM). It became possible to hide all multi-layer defects by using defect avoidance technique through improvement of blank mask defectivity and development of actinic blank inspection tool. In addition, EUV pellicle is also considered as a requisite to guarantee predictable yield. Both development of mask shop tools and preparation of EUV scanner for pellicle are going well. However, still membrane needs to be much improved in terms of transmittance and robustness for HVM. At the conference, EUV mask readiness for HVM will be discussed including blank defect improvement, preparation of actinic tools and pellicle development.

Conference Presentation

Citation Download Citation

Heebom Kim, Chang Young Jeong, Donggun Lee, Ji Hoon Na, Hwan-Seok Seo, Mun Ja Kim, Sung-Won Kwon, and Chan-Uk Jeon "EUV mask readiness for HVM (Conference Presentation)", Proc. SPIE 10451, Photomask Technology 2017, 104510I (16 October 2017); https://doi.org/10.1117/12.2280687

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