Analysis method to define photoresist resolution in EUV lithography

Yongbeom Seo; Heeyoung Go; Jinseong Lee; Taehwan Oh; Donghun Shin; Huiseob Shin; Jisun Lee; Sangjin Kim; In-sung Kim; Changmin Park

doi:10.1117/12.2687461

21 November 2023 Analysis method to define photoresist resolution in EUV lithography

Yongbeom Seo, Heeyoung Go, Jinseong Lee, Taehwan Oh, Donghun Shin, Huiseob Shin, Jisun Lee, Sangjin Kim, In-sung Kim, Changmin Park

Author Affiliations +

Proceedings Volume 12750, International Conference on Extreme Ultraviolet Lithography 2023; 127500B (2023) https://doi.org/10.1117/12.2687461
Event: SPIE Photomask Technology + EUV Lithography, 2023, Monterey, California, United States

Abstract

As the semiconductor chip size continues to decrease, extreme ultra violet lithography (EUVL) is becoming a vital technology to achieve the high resolution patterning required for sub-7 nm node technologies. The patterning resolution of EUVL is highly dependent on the performance of EUV photoresists (PR) which can lead to variations in the patterning process and affects the overall quality of the semiconductor. Although there are several traditional methods to determine a patterning performance of PR, it becomes more challenging as scale tighten. To this end, we develop a new analysis method, named ‘W-curve’, defining EUV PR resolution using ADI SEM images, that visualizes micro-bridge and -break defect cliffs and local CD uniformity at the same time. Using W-curve method, 3 different PR performance at 36 nm-pitch line/space pattern was clearly distinguished. Also, the obtained result was well correlated with time-series trend data and electric test data. Therefore, we believe that W-curve method could provide a new insight for understanding EUV PR performance and improve patterning performance in a facile and versatile manner.

Conference Presentation

(2023) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Yongbeom Seo, Heeyoung Go, Jinseong Lee, Taehwan Oh, Donghun Shin, Huiseob Shin, Jisun Lee, Sangjin Kim, In-sung Kim, and Changmin Park "Analysis method to define photoresist resolution in EUV lithography", Proc. SPIE 12750, International Conference on Extreme Ultraviolet Lithography 2023, 127500B (21 November 2023); https://doi.org/10.1117/12.2687461

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