Analysis software development for optical critical dimension based on RCWA and 3D modeling

Jiwon Lee; Minhyeok Lee; Shinyoung Ryu; Kwangwoo Kim; Jongjeong Kim; Tae Dong Kang

doi:10.1117/12.3022262

9 April 2024 Analysis software development for optical critical dimension based on RCWA and 3D modeling

Jiwon Lee, Minhyeok Lee, Shinyoung Ryu, Kwangwoo Kim, Jongjeong Kim, Tae Dong Kang

Proceedings Volume 12955, Metrology, Inspection, and Process Control XXXVIII; 129553U (2024) https://doi.org/10.1117/12.3022262
Event: SPIE Advanced Lithography + Patterning, 2024, San Jose, California, United States

Conference Poster

Abstract

This paper introduces our development of software designed for OCD (Optical Critical Dimension) modeling, utilizing 3D graphics design functionality. In the OCD metrology, the role of analysis software is crucial for accurately and precisely extracting CD parameters from intricate device structures. Our software incorporates calculation engines grounded in Physics and Machine Learning - RCWA (Rigorous Coupled Wave Analysis) and DL (Deep Learning). The software's advanced 3D modeling engine supports complex structure manipulation and precise adjustments of a broad range of parameters, including optical properties. This facilitates detailed device geometry exploration through a cohesive interface. The DL algorithm has been developed ensuring consistency between RCWA and DL predictions, essential for accurate and rapid OCD metrology. We have conducted a comprehensive evaluation process to assess the consistency between RCWA calculations and 3D representations, encompassing both 2D and 3D structures. Further evaluation is planned, specifically focusing on real patterned wafers.

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Jiwon Lee, Minhyeok Lee, Shinyoung Ryu, Kwangwoo Kim, Jongjeong Kim, and Tae Dong Kang "Analysis software development for optical critical dimension based on RCWA and 3D modeling", Proc. SPIE 12955, Metrology, Inspection, and Process Control XXXVIII, 129553U (9 April 2024); https://doi.org/10.1117/12.3022262

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