Paper
11 July 2000 Finite-element analysis of fiber shifts in fiber-solder-ferrule joints using AuSn solder
Maw-Tyan Sheen, Paul-Cheng Chen, Jao-Hwa Kuang, Gol-Lin Wang, Wood-Hi Cheng, Hung-Lun Chang, Szu-Chun Wang, Chungyung Wang, Chih-Ming Wang
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Abstract
The thermally induced fiber alignment shifts of fiber- solder-ferrule (FSF) joints in laser module packaging under temperature cycling tests have been studied numerically by a elastic-plastic finite-element method (FEM). The FSF joints were assembled using both the Pb(37)/Sn(63) and Au(80)/Sn(20) solders. Comparison between the calculated results shows that the Au/Sn solder in the FSF joint exhibits three times less fiber than Pb/Sn solder. This is due to the higher Young's modulus, yield strength, and melting temperature of AuSn hard solder than PbSn soft solder. This suggests that the hard solder of Au/Sn is more suitable for use in FSF assembly than soft solder Pb/Sn for laser module packaging to reduce thermally induced fiber alignment shift. Numerical calculations show that the major cause of fiber shift in FSF joints may come from the plastic solder yielding introduced by the thermal stress variation and the redistribution of the residual stresses during temperature cycling.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Maw-Tyan Sheen, Paul-Cheng Chen, Jao-Hwa Kuang, Gol-Lin Wang, Wood-Hi Cheng, Hung-Lun Chang, Szu-Chun Wang, Chungyung Wang, and Chih-Ming Wang "Finite-element analysis of fiber shifts in fiber-solder-ferrule joints using AuSn solder", Proc. SPIE 4078, Optoelectronic Materials and Devices II, (11 July 2000); https://doi.org/10.1117/12.392200
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Cited by 3 scholarly publications.
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KEYWORDS
Finite element methods

Packaging

Fiber lasers

Laser welding

Temperature metrology

Reliability

Semiconductor lasers

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