Finite-element analysis of solder joint strength in laser diode packaging

Chi-Hsiung Chang; Maw-Tyan Sheen; Jao-Hwa Kuang; Chi-Chen Chen; Gol-Lin Wang; Wood-Hi Cheng; Hung-Lon Chang; Szu-Chun Wang; Chungyung Wang; Chih-Ming Wang

doi:10.1117/12.392199

11 July 2000 Finite-element analysis of solder joint strength in laser diode packaging

Chi-Hsiung Chang, Maw-Tyan Sheen, Jao-Hwa Kuang, Chi-Chen Chen, Gol-Lin Wang, Wood-Hi Cheng, Hung-Lon Chang, Szu-Chun Wang, Chungyung Wang, Chih-Ming Wang

Author Affiliations +

Proceedings Volume 4078, Optoelectronic Materials and Devices II; (2000) https://doi.org/10.1117/12.392199
Event: Photonics Taiwan, 2000, Taipei, Taiwan

Abstract

The effect of PbSn solder joint strength on temperature tests in laser diode packaging has been studied experimentally and numerically. It was found that the solder joint strength increased as temperature cycle number increased. A finite-element method (FEM) analysis is performed on the calculation of joint strength of PbSn solder in temperature cycling tests for laser diode packaging. Numerical calculations were in good agreement with the experimental measurements that the solder joint strength increased as the temperature cycle increased. This is may be due to the redistribution of the residual stresses within the solder during the temperature cycling tests, and hence reducing the residual stresses and increasing the solder joint strength as the temperature cycle number increased. The result suggests that the FEM is an effective method for predicting the solder joint strength in laser diode packages.

Citation Download Citation

Chi-Hsiung Chang, Maw-Tyan Sheen, Jao-Hwa Kuang, Chi-Chen Chen, Gol-Lin Wang, Wood-Hi Cheng, Hung-Lon Chang, Szu-Chun Wang, Chungyung Wang, and Chih-Ming Wang "Finite-element analysis of solder joint strength in laser diode packaging", Proc. SPIE 4078, Optoelectronic Materials and Devices II, (11 July 2000); https://doi.org/10.1117/12.392199

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