Efficient approach to improving pattern fidelity with multi-OPC model and recipe

Munhoe Do; Jaehyun Kang; Jaeyoung Choi; Junseok Lee; Yongsuk Lee; Keeho Kim

doi:10.1117/12.686655

20 October 2006 Efficient approach to improving pattern fidelity with multi-OPC model and recipe

Munhoe Do, Jaehyun Kang, Jaeyoung Choi, Junseok Lee, Yongsuk Lee, Keeho Kim

Proceedings Volume 6349, Photomask Technology 2006; 63494P (2006) https://doi.org/10.1117/12.686655
Event: SPIE Photomask Technology, 2006, Monterey, California, United States

Abstract

It is becoming difficult to achieve stable device functionality and yield due to the continuous reduction of layout dimensions. Lithographers must guarantee pattern fidelity throughout the entire range of nominal process variation and diverse layout. Even though we use general OPC method using single model and recipe, we usually expect to obtain good OPC results and ensure the process margin between different devices in the sub-100nm technology node. OPC Model usually predicts the distortion or behavior of layout through the simulation in the range of measured data. If the layout is out of range from the measured data, or CD difference occurred from the topology issue, we can not improve the OPC accuracy with a single OPC model. In addition, as the design rule has decreased, it is extremely hard to obtain the efficient OPC result only with a single OPC recipe. We can not extract the optimized single OPC recipe which can cover all the various device and layout. Therefore, we can improve the OPC accuracy and reduce the turn around time related to the OPC operation and mask manufacturing in sub-100nm technology node by applying the optimized multi OPC recipes to the device which contains the various patterns like SoC.

Citation Download Citation

Munhoe Do, Jaehyun Kang, Jaeyoung Choi, Junseok Lee, Yongsuk Lee, and Keeho Kim "Efficient approach to improving pattern fidelity with multi-OPC model and recipe", Proc. SPIE 6349, Photomask Technology 2006, 63494P (20 October 2006); https://doi.org/10.1117/12.686655

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